MICROCHIP MCP48CMB02-E/UN

The MCP48CXBXX are single and dual-channel 8-bit, 10-bit, and 12-bit buffered voltage output Digital-to-Analog Converters (DAC), with volatile or MTP memory and an SPI serial interface. The MTP memory can be written by the user up to 32 times, for each specific register. It requires a high-voltage level on the HVC pin, typically 7.5Vi, in order to successfully program the desired memory location. The nonvolatile memory includes power-up output values, device configuration registers and general purpose memory. The VREF pin, the device VDD or the internal band gap voltage can be selected as the DAC’s reference voltage. When VDD is selected, VDD is internally connected to the DAC reference circuit. When the VREF pin is used with an external voltage reference, the user can select between a gain of 1 or 2 and can have the reference buffer enabled or disabled. When the gain is 2, the VREF pin voltage should be limited to a maximum of VDD/2. These devices have a four-wire SPI-compatible serial interface with speeds up to 50 MHz for write and 25 MHz for read operations.

• Memory Options:
  • Volatile Memory: MCP48CVBXX
  • Nonvolatile Memory: MCP48CMBXX
• Operating Voltage Range:
  • 2.7V to 5.5V – Full specifications
  • 1.8V to 2.7V – Reduced device specifications
• Output Voltage Resolutions:
  • 8-Bit: MCP48CXB0X (256 steps)
  • 10-Bit: MCP48CXB1X (1024 steps)
  • 12-Bit: MCP48CXB2X (4096 steps)
• Nonvolatile Memory (MTP) Size: 32 Locations
• 1 LSb Integral Nonlinearity (INL) Specification
• DAC Voltage Reference Source Options:
  • Device VDD
  • External VREF pin (buffered or unbuffered)
  • Internal band gap (1.214V typical)
• Output Gain Options:
  • 1x (Unity)
  • 2x (available when not using internal VDD as voltage source)
• Power-on/Brown-out Reset (POR/BOR) Protection
• Power-Down Modes:
  • Disconnects output buffer (High-Impedance)
  • Selection of V0UT pull-down resistors (100 kΩ or 1 kΩ)
• SPI Interface:
  • Supports 0(0) and ‘11’ modes
  • 50 MHz write speed
  • 25 MHz read speed
• Package Types:
  • Dual: 16-lead 3x3 QFN, 10-lead MSOP, 10-lead 3x3 DFN
  • Single: 16-lead 3x3 QFN, 10-lead MSOP, 10-lead 3x3 DFN
• Extended Temperature Range: -40°C to +125°C

• Set Point or Offset Trimming
• Sensor Calibration
• Low-Power Portable Instrumentation
• PC Peripherals
• Data Acquisition Systems