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TI 5962-9471801QRA

Manufacturer
TI
MPN
5962-9471801QRA
LCSC Part #
C3754561
Packaging
CDIP-20
Customer #
Key Attributes
Schmitt trigger 4.5V~5.5V 8 1 2.9ns@5V,50pF CDIP-20 Buffers, Drivers, Receivers, Transceivers
DatasheetTI 5962-9471801QRA
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QtyUnit Price(Reference Only)Total Amount
1+$ 20.6713$ 20.67
200+$ 7.9995$ 1599.90
500+$ 7.7188$ 3859.40
1,000+$ 7.58$ 7580.00
Standard Packaging20/Full Tube
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Products Specifications

All
TypeDescription
CategoryIntegrated Circuits (ICs)/Logic/Buffers, Drivers, Receivers, Transceivers
ManufacturerTI
PackagingCDIP-20
Input typeSchmitt trigger
Voltage - Supply4.5V~5.5V
Output TypeTri-State
Operating Temperature-55℃~+125℃
Quiescent Supply Current250uA
Current - Output High(IOH)32mA
SeriesABT541
Current - Output Low(IOL)64mA
Number of Bits per Element8
Channel Type-
FeaturesPower-off isolation;Output enable
Number of Elements1
Propagation Delay2.9ns@5V,50pF
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Introduction

AI Translation

The SN54ABT541 and SN74ABT541B octal buffers and line drivers are ideal for driving bus lines or buffering memory address registers. The devices feature inputs and outputs on opposite sides of the package to facilitate printed circuit board layout. The 3-state control gate is a two-input AND gate with active-low inputs so that if either output-enable (OE1 or OE2) input is high, all eight outputs are in the high-impedance state. When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The SN54ABT541 is characterized for operation over the full temperature range of - 55℃ to 125℃. The SN74ABT541B is characterized for operation from - 40℃ to 85℃.

Features

AI Translation
  • State-of-the-Art EPiC-IIB BiCMOS Design Significantly Reduces Power Dissipation
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Typical VOLP (Output Ground Bounce) < 1V at VCC = 5V, TA = 25℃
  • High-Impedance State During Power Up and Power Down
  • High-Drive Outputs (-32 mA IOH, 64 mA IOL)
  • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Ceramic Flat (W) Package, and Plastic (N) and Ceramic (J) DIPs

Applications

AI Translation
  • Drive bus lines
  • Buffer memory address registers