Octavo Systems OSD3358-512M-BSM
| Manufacturer | |
| MPN | OSD3358-512M-BSM |
| LCSC Part # | C6944652 |
| Packaging | - |
| Customer # | |
| Key Attributes | Microcontrollers, Microprocessor, FPGA Modules RoHS |
| Datasheet | Octavo Systems OSD3358-512M-BSM |
Products Specifications
| Type | Description | |
|---|---|---|
| Category | Integrated Circuits (ICs)/Embedded/Microcontrollers, Microprocessor, FPGA Modules | |
| Manufacturer | Octavo Systems | |
| Packaging | - | |
| Features | - |
| Type | Description | |
|---|---|---|
| Category | Integrated Circuits (ICs)/Embedded/Microcontrollers, Microprocessor, FPGA Modules | |
| Manufacturer | Octavo Systems |
| Type | Description | |
|---|---|---|
| Packaging | - | |
| Features | - |
Introduction
The OSD335x-SM series system-in-package products are building blocks designed to enable simple and cost-effective deployment of systems based on the Sitara AM335x processor family. These devices integrate the AM335x processor, TPS65217C PMIC, TL5209 LDO regulator, up to 1 GB of DDR3 memory, 4 KB EEPROM for non-volatile configuration storage, and passive components (resistors, capacitors, and inductors) into a ready-to-use 21mm x 21mm package. This level of integration allows designers to focus on the critical aspects of their system without spending time on the complex high-speed design of the processor/DDR3 interface or power distribution for the PMIC. It also reduces the overall size, complexity, and supply chain management of the design. This series can significantly shorten the time-to-market for AM335x-based products.
Features
- Integrates AM335x processor, TPS65217C PMIC, TL5209 LDO, DDR3 memory, EEPROM, and passive components in a single package
- AM335x processor features: ARM Cortex-A8 core up to 1GHz; 8-channel 12-bit SAR ADC; dual-port 10/100/1000 Ethernet; dual-port high-speed USB 2.0 OTG with PHY; three MMC/SD/SDIO interfaces; LCD controller; SGX 3D graphics engine; programmable real-time unit subsystem
- Full access to all AM335x peripherals: CAN, SPI, UART, I2C, GPIO, etc.
- Supports up to 1GB DDR3 memory
- 256-ball BGA, 21mm x 21mm
- Power input: DC adapter, USB, or single-cell Li-Ion/Li-Po battery
- Power output: 1.8V, 3.3V, and system voltage
- Selectable AM335x I/O voltage: 1.8V or 3.3V
- Integrates over 100 components in a single package
- Compatible with AM335x development tools and software
- Wide BGA ball pitch enables low-cost assembly
- Significantly reduced design time and layout complexity
- 60% board space reduction vs. discrete solution
- Improved reliability through reduced component count
- Package: 256-ball BGA, 21mm x 21mm, 16 x 16 grid, 1.27mm ball pitch
- Operating temperature range: 0 to 85°C, -40 to 85°C
| Qty | Unit Price(Reference Only) | Total Amount |
|---|---|---|
| 1+ | $ 99.5719 | $ 99.57 |
| 180+ | $ 39.7312 | $ 7151.62 |
| 480+ | $ 38.4034 | $ 18433.63 |
| 1,020+ | $ 37.7466 | $ 38501.53 |
Standard Packaging60/Full Tray | ||
Products Specifications
| Type | Description | |
|---|---|---|
| Category | Integrated Circuits (ICs)/Embedded/Microcontrollers, Microprocessor, FPGA Modules | |
| Manufacturer | Octavo Systems | |
| Packaging | - | |
| Features | - |
| Type | Description | |
|---|---|---|
| Category | Integrated Circuits (ICs)/Embedded/Microcontrollers, Microprocessor, FPGA Modules | |
| Manufacturer | Octavo Systems |
| Type | Description | |
|---|---|---|
| Packaging | - | |
| Features | - |
Introduction
The OSD335x-SM series system-in-package products are building blocks designed to enable simple and cost-effective deployment of systems based on the Sitara AM335x processor family. These devices integrate the AM335x processor, TPS65217C PMIC, TL5209 LDO regulator, up to 1 GB of DDR3 memory, 4 KB EEPROM for non-volatile configuration storage, and passive components (resistors, capacitors, and inductors) into a ready-to-use 21mm x 21mm package. This level of integration allows designers to focus on the critical aspects of their system without spending time on the complex high-speed design of the processor/DDR3 interface or power distribution for the PMIC. It also reduces the overall size, complexity, and supply chain management of the design. This series can significantly shorten the time-to-market for AM335x-based products.
Features
- Integrates AM335x processor, TPS65217C PMIC, TL5209 LDO, DDR3 memory, EEPROM, and passive components in a single package
- AM335x processor features: ARM Cortex-A8 core up to 1GHz; 8-channel 12-bit SAR ADC; dual-port 10/100/1000 Ethernet; dual-port high-speed USB 2.0 OTG with PHY; three MMC/SD/SDIO interfaces; LCD controller; SGX 3D graphics engine; programmable real-time unit subsystem
- Full access to all AM335x peripherals: CAN, SPI, UART, I2C, GPIO, etc.
- Supports up to 1GB DDR3 memory
- 256-ball BGA, 21mm x 21mm
- Power input: DC adapter, USB, or single-cell Li-Ion/Li-Po battery
- Power output: 1.8V, 3.3V, and system voltage
- Selectable AM335x I/O voltage: 1.8V or 3.3V
- Integrates over 100 components in a single package
- Compatible with AM335x development tools and software
- Wide BGA ball pitch enables low-cost assembly
- Significantly reduced design time and layout complexity
- 60% board space reduction vs. discrete solution
- Improved reliability through reduced component count
- Package: 256-ball BGA, 21mm x 21mm, 16 x 16 grid, 1.27mm ball pitch
- Operating temperature range: 0 to 85°C, -40 to 85°C
Compliance & Export Codes
| Type | Details |
|---|---|
| RoHS | ROHS3 Compliant |
| ECCN | 5A992C |
| CNHTS | 8542319090 |
| USHTS | |
| TARIC | |
| CAHTS | |
| BRHTS | |
| INHTS | |
| MXHTS |
| Type | Details |
|---|---|
| RoHS | ROHS3 Compliant |
| ECCN | 5A992C |
| CNHTS | 8542319090 |
| USHTS | |
| TARIC |
| Type | Details |
|---|---|
| CAHTS | |
| BRHTS | |
| INHTS | |
| MXHTS | |