MICROCHIP MIC4123YME

The MIC4123/4124/4125 family are highly reliable BiCMOS/DMOS buffer/driver/MOSFET drivers. They are higher output current versions of the MIC4126/4127/4128, which are improved versions of the MIC4426/4427/4428. All three families are pin-compatible. The MIC4123/4/5 drivers are capable of providing reliable service in more demanding electrical environments than their predecessors. They will not latch under any conditions within their power and voltage ratings. They can survive up to 5V of noise spiking, of either polarity, on the ground pin. They can accept, without either damage or logic upset, up to half an amp of reverse current (either polarity) forced back into their outputs. The MIC4123/4/5 series drivers are easier to use, more flexible in operation, and more forgiving than other CMOS or bipolar drivers currently available. Their BiCMOS/DMOS construction dissipates minimum power and provides rail-to-rail voltage swings. Primarily intended for driving power MOSFETs, the MIC4123/4/5 drivers are suitable for driving other loads (capacitive, resistive, or inductive) that require low-impedance, high peak currents, and fast switching times. Heavily loaded clock lines, coaxial cables, or piezoelectric transducers are some examples. The only known limitation on loading is that total power dissipated in the driver must be kept within the maximum power dissipation limits of the package.

• Reliable, Low-Power Bipolar/CMOS/DMOS Construction
• Latch-Up Protected to >200 mA Reverse Current
• Logic Input Withstands Swing to –5V
• High 3A Peak Output Current
• Wide 4.5V to 20V Operating Range
• Drives 1800 pF Capacitance in 25 ns
• Short <50 ns Typical Delay Time
• Delay Times Consistent within Supply Voltage Change
• Matched Rise and Fall Times
• TTL Logic Input Independent of Supply Voltage
• Low Equivalent 6 pF Input Capacitance
• Low Supply Current - 3.5 mA with Logic-1 Input - 350 μA with Logic-0 Input
• Low 2.3Ω Typical Output Impedance
• Output Voltage Swings within 25 mV of Ground or VS
• Inverting, Non-Inverting, and Differential Configurations
• Exposed Backside Pad Packaging Reduces Heat - ePad SOIC-8L (θJA=58°C/M) - 4 mm x 4 mm VDFN-8L (θJA=45°C/W)