Infineon CYW43732XKUBGT

This single-chip device provides a highly integrated solution for embedded and IoT wireless systems, integrating single-stream IEEE 802.11a/b/g/n/ac MAC, baseband and RF, along with Bluetooth 5.0. It supports all rates specified in IEEE 802.11a/b/g/n/ac and achieves data rates up to 433.3 Mbps at specific channel bandwidths through support for 256-QAM modulation. The chip integrates power amplifiers and low-noise amplifiers for both the 2.4 GHz and 5 GHz bands. The WLAN section supports SDIO v3.0 and USB 2.0 host interface options, while the Bluetooth section supports USB, SDIO, and high-speed four-wire UART interfaces. The built-in USB 2.0 hub provides a single shared USB connection for both WLAN and Bluetooth target devices. The chip employs advanced design and process technologies to reduce active and idle power consumption, and incorporates a power management unit capable of operating directly from a mobile platform battery, targeting mobile devices with low power and small form factor requirements. It implements sophisticated enhanced collaborative coexistence hardware mechanisms and algorithms to ensure optimal WLAN and Bluetooth co-performance, and provides a coexistence support interface for external RF, enabling overall quality of concurrent voice, video, and data transmission in embedded and IoT systems.

• Compliant with IEEE 802.11ac, supporting single-stream spatial multiplexing with data rates up to 433.3 Mbps.
• Supports 20, 40, and 80 MHz channels with optional short guard interval and 256 QAM modulation.
• Fully compatible with IEEE 802.11a/b/g/n with enhanced performance.
• Integrated dual-band power amplifiers and low-noise amplifiers.
• Supports optional front-end module with integrated T/R switch for 2.4 GHz band.
• Supports Bluetooth and WLAN sharing a single dual-band antenna to reduce system cost.
• Shared Bluetooth and WLAN receive signal path requires no external power splitter while maintaining good sensitivity for both.
• Supports IEEE 802.15.2 external coexistence interface to optimize bandwidth utilization with other wireless technologies.
• Supports standard SDIO v3.0 interface with backward compatibility to SDIO v2.0 host interface.
• Integrated USB 2.0 high-speed interface and USB hub.
• Integrated Arm Cortex R4 processor with tightly coupled memory for full WLAN subsystem functionality.
• Integrated Arm Cortex M3 processor running Bluetooth software from link controller layer to HCI layer.
• Unified software architecture for easy migration from existing and future embedded WLAN and Bluetooth devices.
• Compliant with Bluetooth Core Specification 5.0, supporting all Bluetooth 4.2 optional features.
• Supports Bluetooth Class 1 or Class 2 transmitter operation.
• Supports extended synchronous connections with enhanced voice quality by allowing retransmission of lost packets.
• Supports adaptive frequency hopping to reduce RF interference.
• Supports HCI over high-speed UART and PCM for audio data.
• Low-power design to extend battery life for IoT and embedded devices.
• Supports simultaneous connections of multiple A2DP profiles for stereo audio.
• Supports automatic frequency detection for standard crystal and TCXO values.
• Supports battery voltage range of 3.2 V to 4.8 V with integrated switching regulator.
• Supports programmable dynamic power management.
• 6 Kbit OTP memory for storing board-level parameters.
• 10 GPIO pins.
• 128-ball WLBGA package.
• Supports WPA and WPA2 Personal for encryption and authentication.
• Hardware support for AES and TKIP for fast data encryption with IEEE 802.11i compliance.
• Reference WLAN subsystem provides Wi-Fi Protected Setup functionality.
• Worldwide regulatory support.