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Intel/Altera 1SX210HN1F43E2VG

Producent
Nr części prod.
1SX210HN1F43E2VG
Nr LCSC
C1575845
Opak.
FBGA-1760
Numer Klienta
Klucz. cechy
ARM Cortex-ASeries 1.5GHz FBGA-1760 System On Chip (SoC)
Karta KatalogowaIntel/Altera 1SX210HN1F43E2VG
Brak w magazynie
Powiadom mnie
Minimum: 1Wielokrotność: 1Jednostka sprzedaży: Piece
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Szt.Cena jedn.(Tylko do wglądu)Suma całkowita
1+$ 13128.1131$ 13128.11
24+$ 12468.4064$ 299241.75
Standardowa Obudowa12/Full Tray
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Specyfikacje Produktu

Wszystko
TypOpis
KategoriaIntegrated Circuits (ICs)/Embedded/System On Chip (SoC)
ProducentIntel/Altera
Opak.FBGA-1760
CPU CoreARM Cortex-ASeries
CPU Maximum Speed1.5GHz

Opis

Tłumaczenie AI

Intel’s 14 nm Intel® Stratix® 10 GX FPGAs and SX SoCs deliver 2X the core performance and up to 70% lower power over previous generation high-performance FPGAs. Featuring several groundbreaking innovations, including the all new Intel Hyperflex™ core architecture, this device family enables you to meet the demand for everincreasing bandwidth and processing performance in your most advanced applications, while meeting your power budget. With an embedded hard processor system (HPS) based on a quad-core 64 bit Arm* Cortex*-A53, the Intel Stratix 10 SoC devices deliver power efficient, application-class processing and allow designers to extend hardware virtualization into the FPGA fabric. Intel Stratix 10 SoC devices demonstrate Intel's commitment to high-performance SoCs and extend Intel's leadership in programmable devices featuring an Arm-based processor system. Important innovations in Intel Stratix 10 FPGAs and SoCs include: All new Intel Hyperflex core architecture delivering 2X the core performance compared to previous generation high-performance FPGAs • Intel 14 nm tri-gate (FinFET) technology • Heterogeneous 3D System-in-Package (SiP) technology • Core fabric with up to 10.2 million logic elements (LEs) • Up to 96 full duplex transceiver channels on heterogeneous 3D SiP transceiver tiles • Transceiver data rates up to 28.3 Gbps chip-to-chip/module and backplane performance • M20K (20 Kb) internal SRAM memory blocks • Fractional synthesis and ultra-low jitter LC tank based transmit phase locked loops (PLLs) • Hard PCI Express® Gen3 ×16 intellectual property (IP) blocks • Hard 10GBASE-KR/40GBASE-KR4 Forward Error Correction (FEC) in every transceiver channel • Hard memory controllers and PHY supporting DDR4 rates up to 2666 Mbps per pin Hard fixed-point and IEEE 754 compliant hard floating-point variable precision digital signal processing (DSP) blocks with up to 10 TFLOP compute performance with a power efficiency of 80 GFLOP per Watt Quad-core 64 bit Arm Cortex-A53 embedded processor running up to 1.5 GHz in SoC family variants • Programmable clock tree synthesis for flexible, low power, low skew clock trees Dedicated secure device manager (SDM) for: — Enhanced device configuration and security — AES-256, SHA-256/384 and ECDSA-256/384 encrypt/decrypt accelerators and authentication — Multi-factor authentication Physically Unclonable Function (PUF) service and software programmable device configuration capability Comprehensive set of advanced power saving features delivering up to 70% lower power compared to previous generation high-performance FPGAs Non-destructive register state readback and writeback, to support ASIC prototyping and other applications

Zastosowania

Tłumaczenie AI
  • Compute and Storage—for custom servers, cloud computing and datacenter acceleration
  • Networking—for Terabit, 400G and multi-100G bridging, aggregation, packet processing and traffic management
  • Optical Transport Networks—for OTU4, 2xOTU4, 4xOTU4
  • Broadcast—for high-end studio distribution, head end encoding/decoding, edge quadrature amplitude modulation (QAM)
  • Medical—for diagnostic scanners and diagnostic imaging
  • Test and Measurement—for protocol and application testers
  • Wireless—for next-generation 5G networks
  • ASIC Prototyping—for designs that require the largest FPGA fabric with the highest I/O count