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KEMET CBR04C108B2GAC

Produttore
Cod. Prod.
CBR04C108B2GAC
Cod. LCSC
C7227518
Imballo
0402
Numero Cliente
Attr. chiave
0.1pF 200V 0402 Ceramic Capacitors RoHS
Scheda TecnicaKEMET CBR04C108B2GAC
Parti alternative10
Esaurito
Avvisami
Minimo: 1Multiplo: 1Unità di vendita: Piece
Aggiungi alla Lista BOM
QtàPr. unit.(Solo per riferimento)Importo totale
1+$ 0.2076$ 0.21
200+$ 0.0829$ 16.58
500+$ 0.0801$ 40.05
1,000+$ 0.0787$ 78.70
Package Standard10000/Full Reel
Prezzo migliore per quantità maggiore?
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Specifiche del Prodotto

Tutto
TipoDescrizione
CategoriaPassives/Capacitors/Ceramic Capacitors
ProduttoreKEMET
Imballo0402
Capacitance0.1pF
Voltage Rating200V

Descrizione

Traduzione AI

KEMET's HiQ CBR RF capacitor series features a copper electrode BME (Base Metal Electrode) system, delivering ultra-low ESR and high Q values across VHF, UHF, and microwave frequency bands. The low ESR enables higher RF current handling, making these capacitors ideal for applications such as cellular base stations and telecommunications networks. CBR series capacitors exhibit no capacitance variation over time or voltage, with negligible capacitance change relative to ambient temperature. KEMET's HiQ CBR RF capacitors are characterized using Modelithics™ substrate-scalable models, available in most EDA software. For details on accessing these models, please contact KEMET sales.

Caratteristiche

Traduzione AI
  • Ultra-low ESR and high Q factor
  • High self-resonant frequency (SRF)
  • High thermal stability
  • Frequency range: 1 MHz to 50 GHz
  • Operating temperature range: -55°C to +125°C
  • Base metal electrode (BME) dielectric system
  • Lead-free and RoHS compliant
  • 0201, 0402, 0603, and 0805 case sizes (inches)
  • DC voltage ratings: 6.3 - 500 V
  • Capacitance range: 0.1 pF to 100 pF
  • Available capacitance tolerances: ±0.05 pF, ±0.1 pF, ±0.25 pF, ±0.5 pF, ±1%, ±2%, and ±5%
  • Negligible capacitance variation with temperature
  • 100% pure matte tin-plated terminations for excellent solderability

Applicazioni

Traduzione AI
  • RF Power Amplifiers (PA)
  • Cellular base stations (4G, 5G)
  • WLAN
  • Telecom networks
  • GPS
  • Bluetooth
  • Bypass, coupling, filtering, impedance matching, DC blocking

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