LCSC Electronics logoLCSC Electronics svg logo
Zaloguj
USD
GSI Technology GS832236AGD-333I product image
Zdjęcia poglądowe

GSI Technology GS832236AGD-333I

Producent
GSI TechnologyAsian Brands
Nr części prod.
GS832236AGD-333I
Nr LCSC
C6954722
Opak.
FPBGA-165(13x15)
Numer Klienta
Klucz. cechy
36Mbit FPBGA-165(13x15) Memory RoHS
Karta KatalogowaGSI Technology GS832236AGD-333I
Brak w magazynie
Powiadom mnie
Minimum: 1Wielokrotność: 1Jednostka sprzedaży: Piece
Dodaj do Listy BOM
Szt.Cena jedn.(Tylko do wglądu)Suma całkowita
1+$ 170.573$ 170.57
198+$ 68.06$ 13475.88
504+$ 65.7855$ 33155.89
1,008+$ 64.6617$ 65178.99
Standardowa Obudowa18/Full Tray
Lepsza cena za większą ilość?
$

Specyfikacje Produktu

Wszystko
TypOpis
KategoriaIntegrated Circuits (ICs)/Memory/Memory
ProducentGSI Technology
Opak.FPBGA-165(13x15)
Operating Temperature-40℃~+100℃
FeaturesAuto power-down function;Boundary scan (JTAG) function
Memory Size36Mbit
Voltage - Supply2.3V~2.7V;-;3V~3.6V
Access Time-
Standby Supply Current-
Interface-

Opis

Tłumaczenie AI

GS832218/36A is a 37,748,736-bit high-performance synchronous SRAM with a 2-bit burst address counter. Originally developed to support Level 2 cache applications for high-performance CPUs, the device is now applicable to synchronous SRAM applications ranging from DSP main memory to network chipset support.

Funkcje

Tłumaczenie AI
  • FT pin for user-configurable flow-through or pipelined operation
  • Selectable single-cycle or double-cycle deselect
  • IEEE 1149.1 JTAG boundary scan compatible
  • ZQ mode pin for user-selectable high or low output drive
  • 2.5V ±10% core supply
  • 3.3V ±10% core supply
  • 2.5V or 3.3V I/O supply
  • LBO pin for linear or interleaved burst mode
  • Internal input resistors on mode pins allow pins to float
  • Default SCD x18 or x36 interleaved pipeline mode
  • Byte write and/or global write operation
  • Internal self-timed write cycle
  • Automatic power-down for portable applications
  • JEDEC standard 119-ball and 165-ball BGA packages
  • RoHS-compliant packages available

Zastosowania

Tłumaczenie AI
  • Level 2 cache applications
  • DSP main memory
  • Network chipset support