VICOR BCM352F125M300A00
| Produttore | |
| Cod. Prod. | BCM352F125M300A00 |
| Cod. LCSC | C5557168 |
| Imballo | - |
| Numero Cliente | |
| Attr. chiave | AC DC Configurable Power Supply Modules RoHS |
| Scheda Tecnica | VICOR BCM352F125M300A00 |
Specifiche del Prodotto
| Tipo | Descrizione | |
|---|---|---|
| Categoria | Power Supplies/Power Supplies - External/Internal (Off-Board)/AC DC Configurable Power Supply Modules | |
| Produttore | VICOR | |
| Imballo | - |
| Tipo | Descrizione | |
|---|---|---|
| Categoria | Power Supplies/Power Supplies - External/Internal (Off-Board)/AC DC Configurable Power Supply Modules | |
| Produttore | VICOR |
| Tipo | Descrizione | |
|---|---|---|
| Imballo | - |
Descrizione
The VI Chip Bus Converter is a high-efficiency (>95%) Sine Amplitude Converter operating from a primary bus of 330 to 365 VDC, providing an isolated ratio output voltage of 11.79 to 13.04 VDC. The SAC delivers low AC impedance beyond the bandwidth of most downstream regulators, meaning the input capacitance typically located at the regulator input can instead be placed at the SAC input. Due to the 1/28 K factor of the BCM352x125y300A00, this capacitance value can be reduced by a factor of 784, saving board area, materials, and overall system cost. The BCM352F125y300A00 is housed in a VI Chip package compatible with standard pick-and-place and SMT assembly processes. The package offers flexible thermal management through its low junction-to-case and junction-to-board thermal resistance. With high conversion efficiency, the BCM352x125y300A00 improves overall system efficiency and reduces operating costs compared to conventional solutions.
Caratteristiche
- 352 VDC to 12.5 VDC 300W bus converter
- High efficiency (>95%) reducing system power consumption
- High power density (1000W/in³) reducing power system footprint by >40%
- "Full Brick" VI Chip package supports SMT for low-impedance interconnection with system board
- Integrated protection against undervoltage, overvoltage, overcurrent, short circuit, and overtemperature
- Enable/disable control and internal temperature monitoring
- ZVS/ZCS resonant sinusoidal amplitude converter topology
- Parallelable for multi-kilowatt array configurations
Applicazioni
- High-end computing systems
- Automated test equipment
- High-density power supplies
| Qtà | Pr. unit.(Solo per riferimento) | Importo totale |
|---|---|---|
| 1+ | $ 1007.1062 | $ 1007.11 |
| 200+ | $ 401.8433 | $ 80368.66 |
| 500+ | $ 388.4148 | $ 194207.40 |
| 1,000+ | $ 381.7793 | $ 381779.30 |
Package Standard1/Full Tray | ||
Specifiche del Prodotto
| Tipo | Descrizione | |
|---|---|---|
| Categoria | Power Supplies/Power Supplies - External/Internal (Off-Board)/AC DC Configurable Power Supply Modules | |
| Produttore | VICOR | |
| Imballo | - |
| Tipo | Descrizione | |
|---|---|---|
| Categoria | Power Supplies/Power Supplies - External/Internal (Off-Board)/AC DC Configurable Power Supply Modules | |
| Produttore | VICOR |
| Tipo | Descrizione | |
|---|---|---|
| Imballo | - |
Descrizione
The VI Chip Bus Converter is a high-efficiency (>95%) Sine Amplitude Converter operating from a primary bus of 330 to 365 VDC, providing an isolated ratio output voltage of 11.79 to 13.04 VDC. The SAC delivers low AC impedance beyond the bandwidth of most downstream regulators, meaning the input capacitance typically located at the regulator input can instead be placed at the SAC input. Due to the 1/28 K factor of the BCM352x125y300A00, this capacitance value can be reduced by a factor of 784, saving board area, materials, and overall system cost. The BCM352F125y300A00 is housed in a VI Chip package compatible with standard pick-and-place and SMT assembly processes. The package offers flexible thermal management through its low junction-to-case and junction-to-board thermal resistance. With high conversion efficiency, the BCM352x125y300A00 improves overall system efficiency and reduces operating costs compared to conventional solutions.
Caratteristiche
- 352 VDC to 12.5 VDC 300W bus converter
- High efficiency (>95%) reducing system power consumption
- High power density (1000W/in³) reducing power system footprint by >40%
- "Full Brick" VI Chip package supports SMT for low-impedance interconnection with system board
- Integrated protection against undervoltage, overvoltage, overcurrent, short circuit, and overtemperature
- Enable/disable control and internal temperature monitoring
- ZVS/ZCS resonant sinusoidal amplitude converter topology
- Parallelable for multi-kilowatt array configurations
Applicazioni
- High-end computing systems
- Automated test equipment
- High-density power supplies
Conformità & Codici di Esportazione
| Tipo | Dettagli |
|---|---|
| RoHS | ROHS3 Compliant |
| ECCN | EAR99 |
| CNHTS | |
| USHTS | |
| TARIC | |
| CAHTS | |
| BRHTS | |
| INHTS | |
| MXHTS |
| Tipo | Dettagli |
|---|---|
| RoHS | ROHS3 Compliant |
| ECCN | EAR99 |
| CNHTS | |
| USHTS | |
| TARIC |
| Tipo | Dettagli |
|---|---|
| CAHTS | |
| BRHTS | |
| INHTS | |
| MXHTS | |

