MICROCHIP TVS312SME3
| Produttore | |
| Cod. Prod. | TVS312SME3 |
| Cod. LCSC | C3702093 |
| Imballo | - |
| Numero Cliente | |
| Attr. chiave | 21V 7.1A 150W 13.8V Unidirectional 12V TVS Diodes RoHS |
| Scheda Tecnica | MICROCHIP TVS312SME3 |
| Conformità RoHS | 2 documenti disponibili |
Specifiche del Prodotto
| Tipo | Descrizione | |
|---|---|---|
| Categoria | Circuit Protection/Transient Voltage Suppressors (TVS)/TVS Diodes | |
| Produttore | MICROCHIP | |
| Imballo | - | |
| Clamping Voltage | 21V | |
| Operating Temperature | -65℃~+175℃ | |
| Peak Pulse Current (Ipp) | 7.1A | |
| Peak Pulse Power Dissipation (Ppp) | 150W | |
| Number of Channels | 1 | |
| Voltage - Breakdown | 13.8V | |
| type | TVS | |
| Polarity | Unidirectional | |
| Reverse Leakage Current (Ir) | 1uA | |
| Reverse Stand-Off Voltage (Vrwm) | 12V |
| Tipo | Descrizione | |
|---|---|---|
| Categoria | Circuit Protection/Transient Voltage Suppressors (TVS)/TVS Diodes | |
| Produttore | MICROCHIP | |
| Imballo | - | |
| Clamping Voltage | 21V | |
| Operating Temperature | -65℃~+175℃ | |
| Peak Pulse Current (Ipp) | 7.1A | |
| Peak Pulse Power Dissipation (Ppp) | 150W |
| Tipo | Descrizione | |
|---|---|---|
| Number of Channels | 1 | |
| Voltage - Breakdown | 13.8V | |
| type | TVS | |
| Polarity | Unidirectional | |
| Reverse Leakage Current (Ir) | 1uA | |
| Reverse Stand-Off Voltage (Vrwm) | 12V |
Descrizione
Microsemi's Transient Voltage Suppressor (TVS) series utilizes oxide-passivated Zener-type dies with full-surface metallurgical bonding on both sides of the die, enabling high surge capability with minimal electrical performance degradation under repetitive surge conditions. This series is particularly useful for protecting microprocessors, MOS, CMOS, TTL, ECL, I²L, and linear ICs from stray transients.
Caratteristiche
- 1ms pulse power capability up to 500W
- Picosecond clamping time
- Direct application to all popular microprocessor and IC families
- Metallurgical bonding assembly system for long-term reliability
- Miniature glass package, hermetically sealed
Applicazioni
- Microprocessor protection
- MOS IC protection
- CMOS IC protection
- TTL IC protection
- Linear IC protection
| Qtà | Pr. unit.(Solo per riferimento) | Importo totale |
|---|---|---|
| 1+ | $ 16.4232 | $ 16.42 |
| 200+ | $ 6.3552 | $ 1271.04 |
| 500+ | $ 6.1331 | $ 3066.55 |
| 1,000+ | $ 6.022 | $ 6022.00 |
Package Standard1/Full Bag | ||
Specifiche del Prodotto
| Tipo | Descrizione | |
|---|---|---|
| Categoria | Circuit Protection/Transient Voltage Suppressors (TVS)/TVS Diodes | |
| Produttore | MICROCHIP | |
| Imballo | - | |
| Clamping Voltage | 21V | |
| Operating Temperature | -65℃~+175℃ | |
| Peak Pulse Current (Ipp) | 7.1A | |
| Peak Pulse Power Dissipation (Ppp) | 150W | |
| Number of Channels | 1 | |
| Voltage - Breakdown | 13.8V | |
| type | TVS | |
| Polarity | Unidirectional | |
| Reverse Leakage Current (Ir) | 1uA | |
| Reverse Stand-Off Voltage (Vrwm) | 12V |
| Tipo | Descrizione | |
|---|---|---|
| Categoria | Circuit Protection/Transient Voltage Suppressors (TVS)/TVS Diodes | |
| Produttore | MICROCHIP | |
| Imballo | - | |
| Clamping Voltage | 21V | |
| Operating Temperature | -65℃~+175℃ | |
| Peak Pulse Current (Ipp) | 7.1A | |
| Peak Pulse Power Dissipation (Ppp) | 150W |
| Tipo | Descrizione | |
|---|---|---|
| Number of Channels | 1 | |
| Voltage - Breakdown | 13.8V | |
| type | TVS | |
| Polarity | Unidirectional | |
| Reverse Leakage Current (Ir) | 1uA | |
| Reverse Stand-Off Voltage (Vrwm) | 12V |
Descrizione
Microsemi's Transient Voltage Suppressor (TVS) series utilizes oxide-passivated Zener-type dies with full-surface metallurgical bonding on both sides of the die, enabling high surge capability with minimal electrical performance degradation under repetitive surge conditions. This series is particularly useful for protecting microprocessors, MOS, CMOS, TTL, ECL, I²L, and linear ICs from stray transients.
Caratteristiche
- 1ms pulse power capability up to 500W
- Picosecond clamping time
- Direct application to all popular microprocessor and IC families
- Metallurgical bonding assembly system for long-term reliability
- Miniature glass package, hermetically sealed
Applicazioni
- Microprocessor protection
- MOS IC protection
- CMOS IC protection
- TTL IC protection
- Linear IC protection
Conformità & Codici di Esportazione
| Tipo | Dettagli |
|---|---|
| RoHS | ROHS3 Compliant |
| ECCN | EAR99 |
| CNHTS | 8541100000 |
| USHTS | 8541100040 |
| TARIC | 8541100000 |
| CAHTS | 8541100090 |
| BRHTS | 85411011 |
| INHTS | 85411000 |
| MXHTS | 8541.10.01 |
| Tipo | Dettagli |
|---|---|
| RoHS | ROHS3 Compliant |
| ECCN | EAR99 |
| CNHTS | 8541100000 |
| USHTS | 8541100040 |
| TARIC | 8541100000 |
| Tipo | Dettagli |
|---|---|
| CAHTS | 8541100090 |
| BRHTS | 85411011 |
| INHTS | 85411000 |
| MXHTS | 8541.10.01 |

