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TI 5962-9050602SA

Hersteller
Herst.-Teilenr.
5962-9050602SA
LCSC-Nr.
C3214410
Verp.
-
Kundennummer
Hauptmerkm.
OCTAL BUS TRANSCEIVERS
DatenblattTI 5962-9050602SA
Nicht vorrätig
Benachrichtigen
Minimum: 1Vielfaches: 1Verkaufseinheit: Piece
Zur BOM-Liste hinzufügen
Stk.E-Preis(Nur als Referenz)Gesamtbetrag
1+$ 5.2662$ 5.27
200+$ 2.0383$ 407.66
500+$ 1.9673$ 983.65
1,000+$ 1.9319$ 1931.90
Standardgehäuse1/Full Bag
Besserer Preis bei größerer Menge?
$

Produktspezifikationen

Alle
TypBeschreibung
KategorieIntegrated Circuits (ICs)/Interface/Specialized
HerstellerTI
Verp.-
Interface-
Voltage - Supply4.5V~5.5V
FeaturesEnable/shutdown function
Operating Temperature-55℃~+125℃
Supply Current-
Quiescent Supply Current-
Data Rate-

Beschreibung

KI-Übersetzung

These octal bus transceivers are designed for asynchronous communication between data buses. The implementation of control functions provides maximum timing flexibility.

These devices allow data transfer from bus A to bus B or from bus B to bus A based on the logic levels at the output enable (OEAB and OEBA) inputs.

The output enable inputs can be used to disable the device, effectively isolating the buses. The dual-enable configuration gives the transceiver the ability to latch data by enabling OEAB and OEBA simultaneously. In this configuration, each output reinforces its input. When both OEAB and OEBA are enabled and all other data sources on both sets of bus lines are in a high-impedance state, all 16 bus lines will retain their last state.

The SN54F621 operates over a temperature range of -55°C to 125°C. The SN74F621 operates over a temperature range of 0°C to 70°C.

  • Local bus latch capability
  • Noninverting logic
  • Package options include plastic small-outline packages, ceramic chip carriers, and standard plastic and ceramic 300-mil DIP

Merkmale

KI-Übersetzung
  • Local bus latch capability
  • Non-inverting logic
  • Package options include plastic small outline, ceramic chip carrier, and standard plastic and ceramic 300-mil DIP packages

Anwendungen

KI-Übersetzung
  • Asynchronous communication between data buses
  • Local bus latch function
  • Non-inverting logic
  • Package options include plastic small-outline package, ceramic chip carrier, and standard plastic and ceramic 300-mil DIP