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VICOR BCM380P475M800A31

Hersteller
Herst.-Teilenr.
BCM380P475M800A31
LCSC-Nr.
C21853059
Verp.
-
Kundennummer
Hauptmerkm.
DC DC Converters RoHS
DatenblattVICOR BCM380P475M800A31
Nicht vorrätig
Benachrichtigen
Minimum: 1Vielfaches: 1Verkaufseinheit: Piece
Zur BOM-Liste hinzufügen
Stk.E-Preis(Nur als Referenz)Gesamtbetrag
1+$ 206.6035$ 206.60
200+$ 194.0418$ 38808.36
500+$ 187.5583$ 93779.15
1,000+$ 184.3535$ 184353.50
Standardgehäuse25/Full Tray
Besserer Preis bei größerer Menge?
$

Produktspezifikationen

Alle

Beschreibung

KI-Übersetzung

The BCM6123xD1E5116yzz bus converter is a high-efficiency sine amplitude converter operating from a 260 to 410 VDC primary bus, delivering 32.5 to 51.3 VDC isolated, ratio-metric secondary voltage. The product features low noise, fast transient response, and industry-leading efficiency and power density. In addition, it presents an AC impedance that exceeds the bandwidth of most downstream regulators, enabling the input capacitance typically placed at the input of point-of-load regulators to be relocated to the primary side of the BCM module. With a 1/8 primary-to-secondary K factor, this capacitance value can be reduced by 64×, saving board area, bill of materials, and overall system cost. Leveraging the thermal performance and density advantages of ChiP packaging technology, the BCM module offers flexible thermal management options with very low top- and bottom-side thermal impedance. The thermally adaptable ChiP-based power component enables customers to rapidly and predictably realize low-cost power system solutions with system size, weight, and efficiency attributes previously unattainable. The product is capable of reverse full-rated-power operation following a prior forward startup.

Merkmale

KI-Übersetzung
  • Continuous secondary-side current up to 16.9A
  • Power density up to 1250W/in³
  • Peak efficiency up to 97.7%
  • Isolation voltage of 4242VDC
  • Supports parallel operation for multi-kilowatt arrays
  • Over-voltage, over-current, under-voltage, short-circuit, and thermal protection
  • 6123 through-hole ChiP package, 2.494in × 0.898in × 0.286in (63.34mm × 22.80mm × 7.26mm)
  • PMBus management interface

Anwendungen

KI-Übersetzung
  • 380VDC power distribution systems
  • High-end computing systems
  • Automated test equipment
  • Industrial systems
  • High-density power supplies