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RENESAS AT25XV041B-XMHV-T

Produttore
Cod. Prod.
AT25XV041B-XMHV-T
Cod. LCSC
C2061740
Imballo
TSSOP-8
Numero Cliente
Attr. chiave
1.65V~4.4V 85MHz SPI TSSOP-8 Memory RoHS
Scheda TecnicaRENESAS AT25XV041B-XMHV-T
Disponibile: 10
10 Pronta consegna
Minimo: 1Multiplo: 1Unità di vendita: Piece
Aggiungi alla Lista BOM
QtàPr. unit.Importo totale
1+$ 2.9162$ 2.92
10+$ 2.848$ 28.48
30+$ 2.8025$ 84.08
100+$ 2.757$ 275.70
Package Standard4000/Full Reel
Prezzo migliore per quantità maggiore?
$

Specifiche del Prodotto

Tutto
TipoDescrizione
CategoriaIntegrated Circuits (ICs)/Memory/Memory
ProduttoreRENESAS
ImballoTSSOP-8
Operating Temperature-
Features-
Memory Size-
Voltage - Supply1.65V~4.4V
Program / Erase Cycles100,000 cycles
Clock Frequency85MHz
Data Retention - TDR (Year)20 Years
Block Erase Time(tBE)45ms@(4KB)
Write Cycle Time(tWC)-
Page Programming Time (Tpp)1.85ms
Standby Supply Current25uA
InterfaceSPI

Descrizione

Traduzione AI

The AT25XV041B is a serial interface Flash memory device for a wide variety of high-volume consumer and connected applications. It can be operated using modern Lithium battery technologies over a wide input voltage range of 1.65V to 4.4V. It is designed for:

  • systems in which program code is shadowed from Flash memory into embedded or external RAM (Code Shadow) for execution,
  • where code is updated over the air,
  • where small amounts of data are stored locally in the flash memory.

The erase block sizes of the AT25XV041B have been optimized to meet the needs of today's code and data storage applications. The device supports 256-byte Page erase, as well as 4-kbyte, 32-kbyte, and 64-kbyte block erase operations. By optimizing the size of the erase blocks, the memory space can be used much more efficiently. This device’s innovative design features also include: active interrupt (allowing the host to sleep during lengthy programming), erase operations (allowing the memory device to wake the MCU when completed), as well as optimized energy consumption and class-leading <200nA ultra-deep power-down modes.

The AT25XV041B is optimized for connected low-energy applications.

The device contains a specialized one-time programmable (OTP) security register that can be used for: unique device serialization, system-level Electronic Serial Number (ESN) storage, and locked key storage.

It can even be adapted with the MCU firmware to create a USE-ONCE system applicable to disposable consumables.

Specifically designed for use in a wide variety of systems, the AT25XV041B supports read, program, and erase operations. No separate voltage is required for programming and erasing.

Caratteristiche

Traduzione AI
  • Single 1.65V - 4.4V Supply
  • Serial Peripheral Interface (SPI) Compatible
  • Supports SPI Modes 0 and 3
  • Supports Dual-I/O Operation 85MHz Maximum Operating Frequency
  • Clock-to-Output (tV) of 7.5 ns
  • Flexible, Optimized Erase Architecture for Code + Data Storage Applications
  • Small (256-Byte) Page Erase
  • Uniform 4-Kbyte Block Erase
  • Uniform 32-Kbyte Block Erase
  • Uniform 64-Kbyte Block Erase
  • Full Chip Erase
  • Hardware Controlled Locking of Protected Sectors via WP Pin
  • 128-byte, One-Time Programmable (OTP) Security Register
  • 64 bytes factory programmed with a unique identifier
  • 64 bytes user programmable
  • Flexible Programming
  • Byte/Page Program (1 to 256 Bytes)
  • Dual-Input Byte/Page Program (1 to 256 Bytes)
  • Sequential Program Mode Capability
  • Fast Program and Erase Times
  • 1.85ms Typical Page Program (256 Bytes) Time
  • 45ms Typical 4-Kbyte Block Erase Time
  • 360ms Typical 32-Kbyte Block Erase Time
  • 720ms Typical 64-Kbyte Block Erase Time
  • Automatic Checking and Reporting of Erase/Program Failures
  • Software Controlled Reset
  • JEDEC Standard Manufacturer and Device ID Read Methodology
  • Low Power Dissipation
  • 200nA Ultra Deep Power Down current (Typical)
  • 5μA Deep Power-Down Current (Typical)
  • 25uA Standby Current (Typical)
  • 3.5mA Active Read Current (Typical)
  • Endurance: 100,000 Program/Erase Cycles
  • Data Retention: 20 Years
  • Complies with Full Industrial Temperature Range
  • Industry Standard Green (Pb/Halide-free/RoHS Compliant) Package Options
  • 8-lead SOIC (150-mil)
  • 8-pad Ultra Thin DFN (2x3x0.6 mm)
  • 8-pad Ultra Thin DFN (5x6x0.6 mm)
  • 8-lead TSSOP Package
  • 8-ball WLCSP (3x2x3 ball matrix)