ATP Electronics, Inc. AF032GEC5A-2001IX
| Hersteller | |
| Herst.-Teilenr. | AF032GEC5A-2001IX |
| LCSC-Nr. | C17504138 |
| Verp. | BGA-153(11.5x13) |
| Kundennummer | |
| Hauptmerkm. | BGA-153(11.5x13) Memory RoHS |
| Datenblatt | ATP Electronics, Inc. AF032GEC5A-2001IX |
Produktspezifikationen
| Typ | Beschreibung | |
|---|---|---|
| Kategorie | Integrated Circuits (ICs)/Memory/Memory | |
| Hersteller | ATP Electronics, Inc. | |
| Verp. | BGA-153(11.5x13) | |
| Features | Built-in wear leveling function;ECC error correction function;Power-down data protection function;Hardware reset function;Secure write protection function;Secure erase function |
| Typ | Beschreibung | |
|---|---|---|
| Kategorie | Integrated Circuits (ICs)/Memory/Memory | |
| Hersteller | ATP Electronics, Inc. |
| Typ | Beschreibung | |
|---|---|---|
| Verp. | BGA-153(11.5x13) | |
| Features | Built-in wear leveling function;ECC error correction function;Power-down data protection function;Hardware reset function;Secure write protection function;Secure erase function |
Beschreibung
The ATP industrial e.MMC is an advanced storage solution that integrates NAND flash memory, a sophisticated flash controller, and a fast MultiMedia Card (MMC) interface in the same package. By incorporating these components in an integrated package, ATP e.MMC manages all background operations internally, freeing the host from handling low-level flash operations for faster and more efficient processing. Smaller than a typical postage stamp, ATP e.MMC comes in a 153-ball fine pitch ball grid array (FBGA package). The tiny footprint makes it perfectly suitable for embedded systems with space constraints but require rugged endurance, reliability and durability in harsh environments. ATP e.MMC is built to meet the tough demands of industrial applications. As a soldered-down solution, it is secure against constant vibrations. Its industrial temperature rating means that severe scenarios from freezing cold -40℃ to blistering hot 105℃ will not cause adverse impact on the device or the data in it. Compliant with the latest JEDEC e.MMC 5.1 Standard (JESD84-B51), ATP e.MMC features Command Queuing and Cache Barrier to enhance random read/write performance; High Speed 400 (HS400) DDR Mode for a bandwidth of up to 400 MB/s; and field firmware update (FFU). Cache Flushing Report ensures the data integrity on cache blocks; Enhanced Strobe in HS400 Mode facilitates faster synchronization between the host and the e.MMC device; and, Secure Write Protection ensures that only trusted entities can protect or unprotect the e.MMC device. It is backward compatible with previous versions (v4.41/v4.5/v5.0), supporting features such as power-off notifications, packed commands, cache, boot or replay protected memory block (RPMB) partitions, high priority interrupt (HPI), and hardware (HW) reset.
Merkmale
- AEC-Q100 Grade 2(-40℃~105℃) Compliant
- AEC-Q100 Grade 3 (-40℃~85℃) Compliant
- Extra-high endurance: 2 - 3X higher than standard e.MMC
- Complies with JEDEC e.MMC v5.1 Standard (JESD84-B51)
- 153-ball FBGA (RoHS compliant, "green package")
- LDPC ECC engine
- Designed with 3D NAND
| Stk. | E-Preis(Nur als Referenz) | Gesamtbetrag |
|---|---|---|
| 1+ | $ 99.3687 | $ 99.37 |
| 200+ | $ 39.6497 | $ 7929.94 |
| 500+ | $ 38.3244 | $ 19162.20 |
| 760+ | $ 37.6704 | $ 28629.50 |
Standardgehäuse760/Full Tray | ||
Produktspezifikationen
| Typ | Beschreibung | |
|---|---|---|
| Kategorie | Integrated Circuits (ICs)/Memory/Memory | |
| Hersteller | ATP Electronics, Inc. | |
| Verp. | BGA-153(11.5x13) | |
| Features | Built-in wear leveling function;ECC error correction function;Power-down data protection function;Hardware reset function;Secure write protection function;Secure erase function |
| Typ | Beschreibung | |
|---|---|---|
| Kategorie | Integrated Circuits (ICs)/Memory/Memory | |
| Hersteller | ATP Electronics, Inc. |
| Typ | Beschreibung | |
|---|---|---|
| Verp. | BGA-153(11.5x13) | |
| Features | Built-in wear leveling function;ECC error correction function;Power-down data protection function;Hardware reset function;Secure write protection function;Secure erase function |
Beschreibung
The ATP industrial e.MMC is an advanced storage solution that integrates NAND flash memory, a sophisticated flash controller, and a fast MultiMedia Card (MMC) interface in the same package. By incorporating these components in an integrated package, ATP e.MMC manages all background operations internally, freeing the host from handling low-level flash operations for faster and more efficient processing. Smaller than a typical postage stamp, ATP e.MMC comes in a 153-ball fine pitch ball grid array (FBGA package). The tiny footprint makes it perfectly suitable for embedded systems with space constraints but require rugged endurance, reliability and durability in harsh environments. ATP e.MMC is built to meet the tough demands of industrial applications. As a soldered-down solution, it is secure against constant vibrations. Its industrial temperature rating means that severe scenarios from freezing cold -40℃ to blistering hot 105℃ will not cause adverse impact on the device or the data in it. Compliant with the latest JEDEC e.MMC 5.1 Standard (JESD84-B51), ATP e.MMC features Command Queuing and Cache Barrier to enhance random read/write performance; High Speed 400 (HS400) DDR Mode for a bandwidth of up to 400 MB/s; and field firmware update (FFU). Cache Flushing Report ensures the data integrity on cache blocks; Enhanced Strobe in HS400 Mode facilitates faster synchronization between the host and the e.MMC device; and, Secure Write Protection ensures that only trusted entities can protect or unprotect the e.MMC device. It is backward compatible with previous versions (v4.41/v4.5/v5.0), supporting features such as power-off notifications, packed commands, cache, boot or replay protected memory block (RPMB) partitions, high priority interrupt (HPI), and hardware (HW) reset.
Merkmale
- AEC-Q100 Grade 2(-40℃~105℃) Compliant
- AEC-Q100 Grade 3 (-40℃~85℃) Compliant
- Extra-high endurance: 2 - 3X higher than standard e.MMC
- Complies with JEDEC e.MMC v5.1 Standard (JESD84-B51)
- 153-ball FBGA (RoHS compliant, "green package")
- LDPC ECC engine
- Designed with 3D NAND
C17504138 EasyEDA-Bibliothek
Compliance & Exportcodes
| Typ | Details |
|---|---|
| RoHS | ROHS3 Compliant |
| ECCN | 3A991B1A |
| CNHTS | 8542329000 |
| USHTS | 8542320071 |
| TARIC | 8542329000 |
| CAHTS | 8542330000 |
| BRHTS | 85423299 |
| INHTS | 85423200 |
| MXHTS | 8542.32.99 |
| Typ | Details |
|---|---|
| RoHS | ROHS3 Compliant |
| ECCN | 3A991B1A |
| CNHTS | 8542329000 |
| USHTS | 8542320071 |
| TARIC | 8542329000 |
| Typ | Details |
|---|---|
| CAHTS | 8542330000 |
| BRHTS | 85423299 |
| INHTS | 85423200 |
| MXHTS | 8542.32.99 |