LCSC Electronics logoLCSC Electronics svg logo
Anmelden
USD
MICROCHIP ATWINC1500-MR210UB1954 product image
Abbildung ähnlich

MICROCHIP ATWINC1500-MR210UB1954

Hersteller
Herst.-Teilenr.
ATWINC1500-MR210UB1954
LCSC-Nr.
C1526200
Verp.
SMD-28P
Kundennummer
Hauptmerkm.
SMD-28P RF Transceiver Modules and Modems RoHS
DatenblattMICROCHIP ATWINC1500-MR210UB1954
RoHS-Konformität2 Dokumente verfügbar
Nicht vorrätig
Benachrichtigen
Minimum: 1Vielfaches: 1Verkaufseinheit: Piece
Zur BOM-Liste hinzufügen
Stk.E-Preis(Nur als Referenz)Gesamtbetrag
1+$ 32.4203$ 32.42
200+$ 12.5476$ 2509.52
500+$ 12.1066$ 6053.30
1,000+$ 11.8884$ 11888.40
Standardgehäuse50/Full Tray
Besserer Preis bei größerer Menge?
$

Produktspezifikationen

Alle
TypBeschreibung
KategorieRF and Wireless/RF Transceiver Modules and Modems
HerstellerMICROCHIP
Verp.SMD-28P
FeaturesCRC check function;Supports FEC function

Beschreibung

KI-Übersetzung

The ATWINC15x0-MR210xB is a low power consumption 802.11 b/g/n IoT (Internet of Things) module, specifically optimized for low power IoT applications. The module integrates Power Amplifier (PA), Low-Noise Amplifier (LNA), Switch, Power Management, and a printed antenna or a micro co-ax (u.FL) connector for an external antenna resulting in a small form factor (21.7×14.7×2.1 mm) design. It is interoperable with various vendors’ 802.11 b/g/n access points. This module provides SPI ports to interface with a host controller.

Merkmale

KI-Übersetzung
  • IEEE 802.11 b/g/n 20 MHz (1x1) solution
  • Single spatial stream in 2.4 GHz ISM band
  • Integrated Transmit/Receive switch
  • Integrated PCB antenna or u.FL micro co-ax connector for external antenna
  • Superior sensitivity and range via advanced PHY signal processing
  • Advanced equalization and channel estimation
  • Advanced carrier and timing synchronization
  • Wi-Fi Direct (supported till firmware release 19.5.2)
  • Soft-AP support
  • Supports IEEE 802.11 WEP, WPA, WPA2 security
  • Support Enterprise security with WPA/WPA2 (802.1X)
    • EAP-TLS
    • EAP-PEAPv0/1 with TLS
    • EAP-TTLSv0 with MSCHAPv2
    • EAP-PEAPv0/1 with MSCHAPv2
  • Superior MAC throughput via hardware accelerated two-level A-MSDU/A-MPDU frame aggregation and block acknowledgment
  • On-chip memory management engine to reduce host load
  • SPI host interface
  • Operating temperature range from -40°C to +85°C
  • RF performance at room temperature of 25°C with a 2 - 3 db change at boundary conditions
  • I/O operating voltage of 2.7V to 3.6V
  • Built-in 26 MHz crystal
  • Integrated Flash memory for system software
  • Power Save modes
    • 4 μA Power-Down mode typical at 3.3V I/O
    • 380 μA Doze mode with chip settings preserved (used for beacon monitoring)
  • On-chip low power sleep oscillator
  • Fast host wake-up from Doze mode by a pin or SPI transaction
  • Fast Boot options
    • On-chip boot ROM (Firmware instant boot)
    • SPI flash boot
  • Low-leakage on-chip memory for state variables
  • Fast AP re-association (150 ms)
  • On-chip Network stack to offload MCU
  • Integrated Network IP stack to minimize host CPU requirements
  • Network features TCP, UDP, DHCP, ARP, HTTP, TLS, and DNS
  • Hardware accelerators for Wi-Fi and TLS security to improve connection time
  • Hardware accelerator for IP checksum
  • Hardware accelerators for OTA security
  • Small footprint host driver
  • Wi-Fi Alliance certifications for Connectivity and Optimizations ID: WFA61069