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RENESAS 71256L25Y

Produttore
Cod. Prod.
71256L25Y
Cod. LCSC
C7032769
Imballo
SOJ-28
Numero Cliente
Attr. chiave
256Kbit SOJ-28 Memory
Scheda TecnicaRENESAS 71256L25Y
Esaurito
Avvisami
Minimo: 1Multiplo: 1Unità di vendita: Piece
Aggiungi alla Lista BOM
QtàPr. unit.(Solo per riferimento)Importo totale
1+$ 2.6475$ 2.65
200+$ 1.0563$ 211.26
500+$ 1.0214$ 510.70
1,000+$ 1.0048$ 1004.80
Package Standard1000/Full Reel
Prezzo migliore per quantità maggiore?
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Specifiche del Prodotto

Tutto
TipoDescrizione
CategoriaIntegrated Circuits (ICs)/Memory/Memory
ProduttoreRENESAS
ImballoSOJ-28
Operating Temperature-
FeaturesAuto power-down function
Memory Size256Kbit
Voltage - Supply4.5V~5.5V;-
Access Time25ns
Standby Supply Current-
Interface-

Descrizione

Traduzione AI

The IDT 71256 is a 262,144-bit high-speed SRAM organized as 32K × 8. It is fabricated using IDT's high-performance, high-reliability CMOS technology. Address access time is as fast as 20ns, with typical power dissipation of only 350mW. The device also offers a low-power standby mode. When the chip select signal (CS̄) is deasserted high, the circuit automatically enters and remains in low-power standby mode as long as CS̄ stays high. In full standby mode, typical power dissipation of the low-power device is less than 15μW. This feature significantly reduces system-level power consumption and thermal management costs. The low-power (L) version also supports battery-backup data retention, with typical power dissipation of only 5μW when powered by a 2V battery. The IDT 71256 is available in 28-pin (300 or 600 mil) ceramic DIP, 28-pin 300 mil SOJ, 28-pin (600 mil) plastic DIP, and 32-pin leadless chip carrier packages, enabling high board-level packaging density.

Caratteristiche

Traduzione AI
  • High-speed address/chip select access times
    • Industrial grade: 25/35ns (max)
    • Commercial grade: 20/25/35ns (max) in low-power mode only
  • Low-power operation
  • Battery backup operation - 2V data retention
  • Fabricated using advanced high-performance CMOS technology
  • Inputs and outputs directly TTL-compatible
  • Available in standard 28-pin (300 or 600 mil) ceramic DIP, 28-pin (600 mil) plastic DIP, 28-pin (300 mil) small outline J-lead, and 32-pin leadless chip carrier packages