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ADI ADSP-BF703BBCZ-3

Produttore
Cod. Prod.
ADSP-BF703BBCZ-3
Cod. LCSC
C659945
Imballo
BGA-184(12x12)
Numero Cliente
Attr. chiave
300MHz BGA-184(12x12) DSP (Digital Signal Processors) RoHS
Scheda TecnicaADI ADSP-BF703BBCZ-3
Conformità RoHS1 documenti disponibili
Esaurito
Avvisami
Minimo: 1Multiplo: 1Unità di vendita: Piece
Aggiungi alla Lista BOM
QtàPr. unit.(Solo per riferimento)Importo totale
1+$ 8.316$ 8.32
10+$ 7.1335$ 71.34
30+$ 6.412$ 192.36
100+$ 5.8092$ 580.92
Package Standard189/Full Tray
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Specifiche del Prodotto

Tutto
TipoDescrizione
CategoriaIntegrated Circuits (ICs)/Embedded/DSP (Digital Signal Processors)
ProduttoreADI
ImballoBGA-184(12x12)
Operating Temperature-40℃~+85℃
FeaturesHardware MAC acceleration;Zero-overhead loop;Circular buffer support;Parallel data channel;DMA data transfer;High-speed peripheral interface;Integrated ADC interface;Interrupt response;Secure storage and protection;RTC and timer
Clock Rate300MHz

Descrizione

Traduzione AI

The ADSP-BF70x processor is a member of the Blackfin family of products. The Blackfin processor combines a dualMAC 16-bit state-of-the-art signal processing engine, the advantages of a clean, orthogonal RISC-like microprocessor instruction set, and single-instruction, multiple-data (SIMD) multimedia capabilities into a single instruction-set architecture. New enhancements to the Blackfin + core add 32-bit MAC and 16-bit complex MAC support, cache enhancements, branch prediction and other instruction set improvements—all while maintaining instruction set compatibility to previous Blackfin products. The processor offers performance up to 400 MHz, as well as low static power consumption. Produced with a low-power and lowvoltage design methodology, they provide world-class power management and performance. By integrating a rich set of industry-leading system peripherals and memory, the Blackfin processor is the platform of choice for next-generation applications that require RISC-like programmability, multimedia support, and leadingedge signal processing in one integrated package. These applications span a wide array of markets, from automotive systems to embedded industrial, instrumentation, video/image analysis, biometric and power/motor control applications.

Caratteristiche

Traduzione AI
  • Blackfin + core with up to 400 MHz performance
  • Dual 16-bit or single 32-bit MAC support per cycle
  • 16-bit complex MAC and many other instruction set enhancements
  • Instruction set compatible with previous Blackfin products
  • Low-cost packaging 88-Lead LFCSP_VQ (QFN) package (12 mm×12 mm), RoHS compliant
  • 184-Ball CSP_BGA package 12 mm×12 mm×0.8 mm pitch, RoHS compliant
  • Low system power with <100 mW core domain power at 400 MHz (μ<0.25 mW/MHz) at 25℃ TJUNCTION
  • AEC-Q100 qualified for automotive applications
  • 136 kB L1 SRAM with multi-parity-bit protection (64 kB instruction, 64 kB data, 8 kB scratchpad)
  • Large on-chip L2 SRAM with ECC protection 256 kB, 512 kB, 1 MB variants
  • On-chip L2 ROM (512 kB)
  • L3 interface (CSP_BGA only) optimized for lowest system power, providing 16-bit interface to DDR2 or LPDDR DRAM devices (up to 200 MHz)
  • Security and one-time-programmable memory
  • Crypto hardware accelerators
  • Fast secure boot for IP protection
  • memDMA encryption/decryption for fast run-time security

Applicazioni

Traduzione AI
  • automotive systems
  • embedded industrial
  • instrumentation
  • video/image analysis
  • biometric
  • power/motor control applications