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ISSI IS46DR16128C-3DBLA1

Hersteller
ISSIAsian Brands
Herst.-Teilenr.
IS46DR16128C-3DBLA1
LCSC-Nr.
C1353047
Verp.
TWBGA-84(8x12.5)
Kundennummer
Hauptmerkm.
2Gbit 333MHz DDR2 SDRAM TWBGA-84(8x12.5) Memory RoHS
DatenblattISSI IS46DR16128C-3DBLA1
RoHS-Konformität1 Dokumente verfügbar
Alternativteile11
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Minimum: 1Vielfaches: 1Verkaufseinheit: Piece
Zur BOM-Liste hinzufügen
Stk.E-Preis(Nur als Referenz)Gesamtbetrag
1+$ 15.3082$ 15.31
200+$ 5.9254$ 1185.08
500+$ 5.7171$ 2858.55
1,000+$ 5.6137$ 5613.70
Standardgehäuse209/Full Tray
Besserer Preis bei größerer Menge?
$

Produktspezifikationen

Alle
TypBeschreibung
KategorieIntegrated Circuits (ICs)/Memory/Memory
HerstellerISSI
Verp.TWBGA-84(8x12.5)
Operating Temperature-40℃~+85℃
FeaturesBuilt-in phase-locked loop;Auto precharge function;Data mask function;Dynamic on-chip termination
Refresh Current18mA
Memory Size2Gbit
Voltage - Supply80mA;1.7V~1.9V
Clock Frequency333MHz
Memory FormatDDR2 SDRAM

Beschreibung

KI-Übersetzung

ISSI's 2Gb DDR2 SDRAM uses a double-data-rate architecture to achieve high-speed operation. The double-data rate architecture is essentially a 4n-prefetch architecture, with an interface designed to transfer two data words per clock cycle at the 1/O balls. Read and write accesses to the DDR2 SDRAM are burst oriented; accesses start at a selected location and continue for a burst length of four or eight in a programmed sequence. Accesses begin with the registration of an Active command, which is then followed by a Read or Write command. The address bits registered coincident with the active command are used to select the bank and row to be accessed (BA0 - BA2 select the bank; A0 - A13(x16) or A0 - A14(x8) select the row). The address bits registered coincident with the Read or Write command are used to select the starting column location A0 - A9 for the burst access and to determine if the auto precharge A10 command is to be issued. Prior to normal operation, the DDR2 SDRAM must be initialized.

Merkmale

KI-Übersetzung
  • VDD = 1.8V ± 0.1V, VDDQ = 1.8V ± 0.1V
  • JEDEC standard 1.8V I/O (SSTL_18-compatible)
  • Double data rate interface: two data transfers per clock cycle
  • Differential data strobe (DQS, DQS)
  • 4-bit prefetch architecture
  • On chip DLL to align DQ and DQS transitions with CK
  • 8 internal banks for concurrent operation
  • Programmable CAS latency (CL) 3, 4, 5, 6, and 7 supported
  • Posted CAS and programmable additive latency (AL) 0, 1, 2, 3, 4, 5, and 6 supported
  • WRITE latency = READ latency - 1 tCK
  • Programmable burst lengths: 4 or 8
  • Adjustable data-output drive strength, full and reduced strength options
  • On-die termination (ODT)

Alternativteile

MPNHerstellerVerpackungVerfügbarkeitStückpreis
IS43DR16128C-3DBLIISSITWBGA-84(8x12.5)0$ 14.6188
IS46DR16128C-3DBLA1-TRISSITWBGA-84(8x12.5)0$ 14.6899
IS43DR16128C-3DBLI-TRISSITWBGA-84(8x12.5)0$ 13.3748
IS46DR16128C-3DBLA2-TRISSITWBGA-84(8x12.5)0$ 37.2413
IS43DR16128C-25DBLI-TRISSITWBGA-84(8x12.5)0$ 18.8411
IS43DR16128C-3DBLISSITWBGA-84(8x12.5)0$ 10.8038
IS43DR16128C-3DBL-TRISSITWBGA-84(8x12.5)0$ 7.9384
IS43DR16128C-25DBLIISSITWBGA-84(8x12.5)0$ 20.087
IS43DR16128C-25DBLISSITWBGA-84(8x12.5)0$ 7.2555
IS43DR16128C-25DBL-TRISSITWBGA-84(8x12.5)0$ 16.8599
IS46DR16128C-3DBLA2ISSITWBGA-84(8x12.5)0$ 21.7188