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RENESAS R5F56317DDFC#V0

Hersteller
Herst.-Teilenr.
R5F56317DDFC#V0
LCSC-Nr.
C1343567
Verp.
LQFP-176(24x24)
Kundennummer
Hauptmerkm.
RX 32 Bit 100MHz LQFP-176(24x24) Microcontrollers RoHS
DatenblattRENESAS R5F56317DDFC#V0
Alternativteile20
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Minimum: 1Vielfaches: 1Verkaufseinheit: Piece
Zur BOM-Liste hinzufügen
Stk.E-Preis(Nur als Referenz)Gesamtbetrag
1+$ 12.9606$ 12.96
200+$ 5.0163$ 1003.26
500+$ 4.8404$ 2420.20
1,000+$ 4.7524$ 4752.40
Standardgehäuse40/Full Tray
Besserer Preis bei größerer Menge?
$

Produktspezifikationen

Alle
TypBeschreibung
KategorieIntegrated Circuits (ICs)/Embedded/Microcontrollers
HerstellerRENESAS
Verp.LQFP-176(24x24)
DAC (Bit)10bit
ADC (Bit)12bit;10bit
Number of I/O133
Operating Temperature-40℃~+85℃
Voltage - Supply2.7V~3.6V
Program Memory TypeFLASH
EEPROM32KB
Program Storage Size384KB
CPU CoreRX
Core Size32 Bit
CPU Maximum Speed100MHz
Oscillator TypeBuilt-in

Beschreibung

KI-Übersetzung

100-MHz 32-bit RX MCU, on-chip FPU, 165 DMIPS, up to 2-MB flash memory, various communications interfaces including Ethernet MAC, full-speed USB 2.0 host/function/OTG interface, CAN, 10- & 12-bit A/D converters, RTC

Merkmale

KI-Übersetzung
  • RX63N Group products incorporate an Ethernet controller while RX631 Group products do not.
  • Max. operating frequency: 100 MHz
  • Capable of 165 DMIPS in operation at 100 MHz
  • Single precision 32-bit IEEE-754 floating point
  • Two types of multiply-and-accumulation unit (between memories and between registers)
  • 32-bit multiplier (fastest instruction execution takes one CPU clock cycle)
  • Divider (fastest instruction execution takes two CPU clock cycles)
  • Fast interrupt
  • CISC Harvard architecture with 5-stage pipeline
  • Variable-length instructions: Ultra-compact code
  • Supports the memory protection unit (MPU)
  • JTAG and FINE (two-line) debugging interfaces
  • Operation from a single 2.7- to 3.6-V supply
  • Low power consumption: A product that supports all peripheral functions draws only 500 μA/MHz.
  • RTC is capable of operation from a dedicated power supply (min. operating voltage: 2.3 V).
  • Four low-power modes
  • Supports ROM-less versions and versions with up to 2 Mbytes of ROM (ROMless/256 Kbytes/384 Kbytes/512 Kbytes: RX631 Group only)
  • 100-MHz operation, 10-ns read cycle (no wait states)
  • 768-Kbyte to 2-Mbyte capacities
  • User code is programmable by on-board or off-board programming
  • ROM-less or 32 Kbytes of ROM (reprogrammable up to 100,000 times)
  • Programming/erasing as background operations (BGOs)
  • 64 Kbytes/128 Kbytes/192 Kbytes/256 Kbytes of SRAM
  • For instructions and operands
  • Can provide backup on deep software standby
  • DMAC: Four channels
  • DTC
  • EXDMAC: Two channels
  • Dedicated DMAC for the Ethernet controller: Single channel
  • Power-on reset (POR)
  • Low voltage detection (LVD) with voltage settings
  • External crystal oscillator or internal PLL for operation at 4 to 16 MHz
  • Internal 125-kHz LOCO and 50-MHz HOCO
  • 125-kHz clocks for the IWDT
  • Adjustment functions (30 seconds, leap year, and error)
  • Time capture function (for capturing times in response to event-signal input on external pins)
  • Ethernet MAC (1) (not in RX631 Group products)
  • Host/function or OTG controller (1) and function controller (1) with fullspeed USB 2.0 transfer
  • CAN (compliant with ISO11898-1), incorporating 32 mailboxes (up to 3 modules)
  • SCI with multiple functionalities (up to 13)
  • Choose from among asynchronous mode, clock-synchronous mode, smartcard interface mode, simplified SPI, simplified I2C, and extended serial mode. I2C bus interface for transfer at up to 1 Mbps (up to 4)
  • RSPI for high-speed transfer (up to 3)
  • Parallel data capture unit (PDC) (1) (available for 512 Kbytes/384 Kbytes/ 256 Kbytes flash memory with 177-pin, 176-pin, 145-pin, and 144-pin)
  • Buses for high-speed data transfer (max. operating frequency of 50 MHz)
  • 8 CS areas (8×16 Mbytes)
  • Multiplexed bus or separate bus are selectable per area.
  • 8-, 16-, or 32-bit bus space is selectable per area
  • Independent SDRAM area (128 Mbytes)
  • 16-bit MTU2: input capture, output compare, PWM waveform output, phase-counting mode (6 channels)
  • 16-bit TPU: input capture, output compare, phase-counting mode (12 channels)
  • 8-bit TMR (4 channels)
  • 16-bit compare-match timers (4 channels)
  • Up to 21×12-bit channels, and incorporating 1 sample-and-hold circuit Up to 8×10-bit channels, and incorporating 1 sample-and-hold circuit
  • Addition of results of A/D conversion (in the 12-bit converter)
  • Self diagnosis (for the 10-bit converter)
  • 10-bit D/A converter: 2 channels
  • Temperature sensor for measuring temperature within the chip
  • AES encryption and decryption functions
  • 128/192/256-bit key length
  • ECB/CBC mode
  • 16-byte ID code is provided for each chip (only for the G version)

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