Immagini a scopo illustrativo
Modelli EDAEasyEDA
micron MT35XU256ABA2G12-0AUT TR
| Produttore | |
| Cod. Prod. | MT35XU256ABA2G12-0AUT TR |
| Cod. LCSC | C7307871 |
| Imballo | TPBGA-24(6x8) |
| Numero Cliente | |
| Attr. chiave | 256Mbit 1.7V~2V 200MHz SPI TPBGA-24(6x8) Memory RoHS |
| Scheda Tecnica | micron MT35XU256ABA2G12-0AUT TR |
| Parti alternative | 10 |
Specifiche del Prodotto
Tutto
| Tipo | Descrizione | |
|---|---|---|
| Categoria | Integrated Circuits (ICs)/Memory/Memory | |
| Produttore | micron | |
| Imballo | TPBGA-24(6x8) | |
| Operating Temperature | -40℃~+125℃ | |
| Features | Software write protection;Hardware write protection;Absolute write protection | |
| Memory Size | 256Mbit | |
| Voltage - Supply | 1.7V~2V | |
| Program / Erase Cycles | 100,000 cycles | |
| Clock Frequency | 200MHz | |
| Data Retention - TDR (Year) | 20 Years | |
| Block Erase Time(tBE) | - | |
| Write Cycle Time(tWC) | - | |
| Page Programming Time (Tpp) | - | |
| Standby Supply Current | - | |
| Interface | SPI |
| Tipo | Descrizione | |
|---|---|---|
| Categoria | Integrated Circuits (ICs)/Memory/Memory | |
| Produttore | micron | |
| Imballo | TPBGA-24(6x8) | |
| Operating Temperature | -40℃~+125℃ | |
| Features | Software write protection;Hardware write protection;Absolute write protection | |
| Memory Size | 256Mbit | |
| Voltage - Supply | 1.7V~2V | |
| Program / Erase Cycles | 100,000 cycles |
| Tipo | Descrizione | |
|---|---|---|
| Clock Frequency | 200MHz | |
| Data Retention - TDR (Year) | 20 Years | |
| Block Erase Time(tBE) | - | |
| Write Cycle Time(tWC) | - | |
| Page Programming Time (Tpp) | - | |
| Standby Supply Current | - | |
| Interface | SPI |
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Caratteristiche
Traduzione AI
- SPI-compatible Xccela™ bus interface – Octal DDR protocol – Extended-SPI protocol with octal commands
- Single and double transfer rate (SDR/DDR)
- Clock frequency:
- 166 MHz (MAX) in SDR (166 MB/s) (1.8V)
- 200 MHz (MAX) in DDR (400 MB/s) with DQS (1.8V)
- 133 MHz (MAX) in SDR (133 MB/s) (3.0V)
- 133 MHz (MAX) in DDR (266MB/s) with DQS (3.0V)
- Execute-in-place (XIP)
- PROGRAM/ERASE SUSPEND operations
- Volatile and nonvolatile configuration settings
- Software reset
- Reset pin available
- 3-byte and 4-byte address modes – enable memory access beyond 128Mb
- Dedicated 64-byte OTP area outside main memory – Readable and user-lockable – Permanent lock with PROGRAM OTP command
- Erase capability Bulk erase for monolithic, die erase for stacked devices – Sector erase 128KB uniform granularity Subsector erase 4KB, 32KB granularity
- Security and write protection
- Volatile and nonvolatile locking and software write protection for each 128KB sector
- Nonvolatile configuration locking and password protection
- Protection management register offering enhanced security features
- Hardware write protection: nonvolatile bits (BP[3:0] and TB) define protected area size
- Program/erase protection during power-up
- CRC detects accidental changes to raw data
- Electronic signature
- JEDEC-standard 3-byte signature
- Extended device ID: two additional bytes identify device factory options
- JESD47I-compliant
- Minimum 100,000 ERASE cycles per sector
- Data retention: 20 years (TYP)
- Options Marking
- Voltage
- 1.7–2.0V U
- 2.7–3.6V L
- Density
- 256Mb 256
- 512Mb 512
- 1Gb 01G
- 2Gb 02G
- Device stacking
- Monolithic A
- 2 die stacked B
- 4 die stacked C
- Device Generation B
- Die revision A
- Configuration
- Boot in SDR x1 1
- Boot in DDR x8 2
- Sector Size
- 128KB G
- Packages: JEDEC-standard, RoHS-compliant
- 24-ball T-PBGA 05/6mm x 8mm 12 (5 x 5 array)
- Security features
- Standard security 0
- Special options
- Standard S
- Automotive A
- Operating temperature range
- From -40℃ to +85℃ IT
- From -40℃ to +105℃ AT
- From -40℃ to +125℃ UT
- Voltage
Esaurito
Avvisami
Minimo: 1Multiplo: 1Unità di vendita: Piece
Aggiungi alla Lista BOM
| Qtà | Pr. unit.(Solo per riferimento) | Importo totale |
|---|---|---|
| 1+ | $ 17.5272 | $ 17.53 |
| 200+ | $ 6.9936 | $ 1398.72 |
| 500+ | $ 6.7603 | $ 3380.15 |
| 1,000+ | $ 6.6451 | $ 6645.10 |
Package Standard2500/Full Reel | ||
Prezzo migliore per quantità maggiore?
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Specifiche del Prodotto
Tutto
| Tipo | Descrizione | |
|---|---|---|
| Categoria | Integrated Circuits (ICs)/Memory/Memory | |
| Produttore | micron | |
| Imballo | TPBGA-24(6x8) | |
| Operating Temperature | -40℃~+125℃ | |
| Features | Software write protection;Hardware write protection;Absolute write protection | |
| Memory Size | 256Mbit | |
| Voltage - Supply | 1.7V~2V | |
| Program / Erase Cycles | 100,000 cycles | |
| Clock Frequency | 200MHz | |
| Data Retention - TDR (Year) | 20 Years | |
| Block Erase Time(tBE) | - | |
| Write Cycle Time(tWC) | - | |
| Page Programming Time (Tpp) | - | |
| Standby Supply Current | - | |
| Interface | SPI |
| Tipo | Descrizione | |
|---|---|---|
| Categoria | Integrated Circuits (ICs)/Memory/Memory | |
| Produttore | micron | |
| Imballo | TPBGA-24(6x8) | |
| Operating Temperature | -40℃~+125℃ | |
| Features | Software write protection;Hardware write protection;Absolute write protection | |
| Memory Size | 256Mbit | |
| Voltage - Supply | 1.7V~2V | |
| Program / Erase Cycles | 100,000 cycles |
| Tipo | Descrizione | |
|---|---|---|
| Clock Frequency | 200MHz | |
| Data Retention - TDR (Year) | 20 Years | |
| Block Erase Time(tBE) | - | |
| Write Cycle Time(tWC) | - | |
| Page Programming Time (Tpp) | - | |
| Standby Supply Current | - | |
| Interface | SPI |
Aiuto & FeedbackMostra prodotti simili (0) >
Caratteristiche
Traduzione AI
- SPI-compatible Xccela™ bus interface – Octal DDR protocol – Extended-SPI protocol with octal commands
- Single and double transfer rate (SDR/DDR)
- Clock frequency:
- 166 MHz (MAX) in SDR (166 MB/s) (1.8V)
- 200 MHz (MAX) in DDR (400 MB/s) with DQS (1.8V)
- 133 MHz (MAX) in SDR (133 MB/s) (3.0V)
- 133 MHz (MAX) in DDR (266MB/s) with DQS (3.0V)
- Execute-in-place (XIP)
- PROGRAM/ERASE SUSPEND operations
- Volatile and nonvolatile configuration settings
- Software reset
- Reset pin available
- 3-byte and 4-byte address modes – enable memory access beyond 128Mb
- Dedicated 64-byte OTP area outside main memory – Readable and user-lockable – Permanent lock with PROGRAM OTP command
- Erase capability Bulk erase for monolithic, die erase for stacked devices – Sector erase 128KB uniform granularity Subsector erase 4KB, 32KB granularity
- Security and write protection
- Volatile and nonvolatile locking and software write protection for each 128KB sector
- Nonvolatile configuration locking and password protection
- Protection management register offering enhanced security features
- Hardware write protection: nonvolatile bits (BP[3:0] and TB) define protected area size
- Program/erase protection during power-up
- CRC detects accidental changes to raw data
- Electronic signature
- JEDEC-standard 3-byte signature
- Extended device ID: two additional bytes identify device factory options
- JESD47I-compliant
- Minimum 100,000 ERASE cycles per sector
- Data retention: 20 years (TYP)
- Options Marking
- Voltage
- 1.7–2.0V U
- 2.7–3.6V L
- Density
- 256Mb 256
- 512Mb 512
- 1Gb 01G
- 2Gb 02G
- Device stacking
- Monolithic A
- 2 die stacked B
- 4 die stacked C
- Device Generation B
- Die revision A
- Configuration
- Boot in SDR x1 1
- Boot in DDR x8 2
- Sector Size
- 128KB G
- Packages: JEDEC-standard, RoHS-compliant
- 24-ball T-PBGA 05/6mm x 8mm 12 (5 x 5 array)
- Security features
- Standard security 0
- Special options
- Standard S
- Automotive A
- Operating temperature range
- From -40℃ to +85℃ IT
- From -40℃ to +105℃ AT
- From -40℃ to +125℃ UT
- Voltage
Conformità & Codici di Esportazione
| Tipo | Dettagli |
|---|---|
| RoHS | ROHS3 Compliant |
| ECCN | 3A991B1A |
| CNHTS | 8542329000 |
| USHTS | 8542320071 |
| TARIC | 8542329000 |
| CAHTS | 8542330000 |
| BRHTS | 85423299 |
| INHTS | 85423200 |
| MXHTS | 8542.32.99 |
| Tipo | Dettagli |
|---|---|
| RoHS | ROHS3 Compliant |
| ECCN | 3A991B1A |
| CNHTS | 8542329000 |
| USHTS | 8542320071 |
| TARIC | 8542329000 |
| Tipo | Dettagli |
|---|---|
| CAHTS | 8542330000 |
| BRHTS | 85423299 |
| INHTS | 85423200 |
| MXHTS | 8542.32.99 |
Parti alternative
| MPN | Produttore | Imballaggio | Disponibilità | Prezzo unitario | ||
|---|---|---|---|---|---|---|
| MT35XU256ABA1G12-0AUT | micron | TPBGA-24(6x8) | 30 | $ 21.6498 | ||
| MT35XU256ABA1G12-0AUT TR | micron | TPBGA-24(6x8) | 0 | $ 17.526 | ||
| MT35XU256ABA2G12-0AUT | micron | TPBGA-24(6x8) | 0 | $ 8.1545 | ||
| MT35XU256ABA2G12-0AAT | micron | TPBGA-24(6x8) | 0 | $ 7.0785 | ||
| MX25UM25345GXDI00 | MXIC | CSPBGA-24(6x8) | 0 | $ 4.9947 | ||
| MX25UM25645GXDI00 | MXIC | CSPBGA-24(6x8) | 0 | $ 19.4674 | ||
| GD25LT256EBIR | GigaDevice Semicon Beijing | TFBGA-24(6x8) | 0 | $ 9.4959 | ||
| MX25UM25645GXDI00-T | MXIC | BGA-24(6x8) | 0 | $ 28.1083 | ||
| MT25QU256ABA8E12-0AUT TR | micron | TPBGA-24(6x8) | 0 | $ 15.5107 | ||
| IS25WP256E-RHLA3 | ISSI | TFBGA-24(6x8) | 0 | $ 9.0665 |