LCSC Electronics logoLCSC Electronics svg logo
Anmelden
USD
ADI FIDO5200CBCZ product image
Abbildung ähnlich

ADI FIDO5200CBCZ

Hersteller
Herst.-Teilenr.
FIDO5200CBCZ
LCSC-Nr.
C662455
Verp.
CSPBGA-144
Kundennummer
Hauptmerkm.
CSPBGA-144 Controllers RoHS
DatenblattADI FIDO5200CBCZ
Nicht vorrätig
Benachrichtigen
Minimum: 1Vielfaches: 1Verkaufseinheit: Piece
Zur BOM-Liste hinzufügen
Stk.E-Preis(Nur als Referenz)Gesamtbetrag
1+$ 23.8235$ 23.82
200+$ 9.2192$ 1843.84
500+$ 8.8966$ 4448.30
1,000+$ 8.7361$ 8736.10
Standardgehäuse240/Full Tray
Besserer Preis bei größerer Menge?
$

Produktspezifikationen

Alle
TypBeschreibung
KategorieIntegrated Circuits (ICs)/Interface/Controllers
HerstellerADI
Verp.CSPBGA-144
FeaturesPort status monitoring

Beschreibung

KI-Übersetzung

The fido5100 and fido5200 (REM switch) are programmable IEEE 802.3 10 Mbps/100 Mbps Ethernet Internet Protocol Version 6 (IPv6) and Internet Protocol Version 4 (IPv4) switches that support virtually any Layer 2 or Layer 3 protocol. The switches are personalized to support the desired protocol by firmware that is downloaded from a host processor. The firmware is contained in the real-time Ethernet multiprotocol (REM) switch driver and is downloaded at power-up. The REM switch can be ready for network data operation in less than 4 ms to support fast startup and quick connect type network functionality. The REM switch devices have the same signal assignments as defined in this data sheet. The fido5100 supports the following protocols: PROFINET real time (RT) and isochronous real time (IRT), EtherNet/IP with and without device level ring (DLR), Modbus TCP, and POWERLINK. The fido5200 supports the following protocols: EtherCAT and all protocols defined for the fido5100. The REM switch is intended for use with a host processor. Network operation is handled using the functions and services provided in the REM switch driver. The host processor can implement any protocol stack by integrating it with the REM switch driver. The REM switches are available in a 144-ball chip scale package ball grid array (CSP_BGA) package.

Merkmale

KI-Übersetzung
  • 144-lead CSP_BGA RoHS compliant package
  • -40°C to +105°C industrial temperature range rating
  • 3.3 V input/output buffers
  • IEEE 802.3, 10 Mbps/100 Mbps, half and full duplex, IPv6 and IPv4 communication
  • 2 independent Ethernet ports: 1 MII and 1 RMII interface per port
  • Support for all industrial protocols PROFINET Class B and Class C with fast startup (Version 2.3) EtherNet/IP with QuickConnect, CIP Sync, and CIP Motion Modbus TCP EtherCAT Ethernet POWERLINK
  • Host interface transfer rate: 32 bits per 28 ns
  • Supports EtherCAT cycle times down to 72.5 μs and PROFINET cycle times down to 31.25 μs
  • PI Net Load Class III capable
  • DLR (supervisor and node, announce and beacon based), MRPD, HSR, PRP, shared device, controller redundancy
  • IEEE 1588 Version 2 support: ordinary clock; both peer to peer and end to end transparent clocks, raw frames, and UDP
  • 8 independent timer signals synchronized with an internal precision timer
  • 4 independently programmable timer signals for timer capture events or timer output events
  • 4 timer signals create programmable periodic waveforms synchronized to the internal precision timer
  • DCP, LLDP, DHCP, RSTP, VLAN, IGMP snooping support
  • Forwarding table with aging and learning
  • Drive LEDs for link activity

Anwendungen

KI-Übersetzung
  • Industrial automation
  • Process control
  • Managed Ethernet switch