ADI ADBF705WCBCZ311
| 제조업체 | |
| 제조사 품번 | ADBF705WCBCZ311 |
| LCSC 번호 | C654470 |
| 포장 | CSPBGA-184(12x12) |
| 고객 번호 | |
| 주요 제원 | 300MHz CSPBGA-184(12x12) DSP (Digital Signal Processors) RoHS |
| 데이터시트 | ADI ADBF705WCBCZ311 |
| RoHS 준수 | 1개 문서 이용 가능 |
제품 사양
| 타입 | 설명 | |
|---|---|---|
| 카테고리 | Integrated Circuits (ICs)/Embedded/DSP (Digital Signal Processors) | |
| 제조업체 | ADI | |
| 포장 | CSPBGA-184(12x12) | |
| Operating Temperature | -40℃~+105℃ | |
| Features | Hardware MAC acceleration;Zero-overhead loop;Circular buffer support;DMA data transfer;High-speed peripheral interface;Integrated ADC interface;Integrated PWM control;Interrupt response;Secure storage and protection;RTC and timer | |
| Clock Rate | 300MHz |
| 타입 | 설명 | |
|---|---|---|
| 카테고리 | Integrated Circuits (ICs)/Embedded/DSP (Digital Signal Processors) | |
| 제조업체 | ADI | |
| 포장 | CSPBGA-184(12x12) |
| 타입 | 설명 | |
|---|---|---|
| Operating Temperature | -40℃~+105℃ | |
| Features | Hardware MAC acceleration;Zero-overhead loop;Circular buffer support;DMA data transfer;High-speed peripheral interface;Integrated ADC interface;Integrated PWM control;Interrupt response;Secure storage and protection;RTC and timer | |
| Clock Rate | 300MHz |
개요
The ADSP-BF70x processor is a member of the Blackfin family of products. The Blackfin processor combines a dualMAC 16-bit state-of-the-art signal processing engine, the advantages of a clean, orthogonal RISC-like microprocessor instruction set, and single-instruction, multiple-data (SIMD) multimedia capabilities into a single instruction-set architecture. New enhancements to the Blackfin + core add 32-bit MAC and 16-bit complex MAC support, cache enhancements, branch prediction and other instruction set improvements—all while maintaining instruction set compatibility to previous Blackfin products. The processor offers performance up to 400 MHz, as well as low static power consumption. Produced with a low-power and lowvoltage design methodology, they provide world-class power management and performance. By integrating a rich set of industry-leading system peripherals and memory, the Blackfin processor is the platform of choice for next-generation applications that require RISC-like programmability, multimedia support, and leadingedge signal processing in one integrated package. These applications span a wide array of markets, from automotive systems to embedded industrial, instrumentation, video/image analysis, biometric and power/motor control applications.
주요 특징
- Blackfin + core with up to 400 MHz performance
- Dual 16-bit or single 32-bit MAC support per cycle
- 16-bit complex MAC and many other instruction set enhancements
- Instruction set compatible with previous Blackfin products
- Low-cost packaging 88-Lead LFCSP_VQ (QFN) package (12 mm×12 mm), RoHS compliant
- 184-Ball CSP_BGA package 12 mm×12 mm×0.8 mm pitch, RoHS compliant
- Low system power with <100 mW core domain power at 400 MHz (μ<0.25 mW/MHz) at 25℃ TJUNCTION
- AEC-Q100 qualified for automotive applications
- 136 kB L1 SRAM with multi-parity-bit protection (64 kB instruction, 64 kB data, 8 kB scratchpad)
- Large on-chip L2 SRAM with ECC protection 256 kB, 512 kB, 1 MB variants
- On-chip L2 ROM (512 kB)
- L3 interface (CSP_BGA only) optimized for lowest system power, providing 16-bit interface to DDR2 or LPDDR DRAM devices (up to 200 MHz)
- Security and one-time-programmable memory
- Crypto hardware accelerators
- Fast secure boot for IP protection
- memDMA encryption/decryption for fast run-time security
응용 분야
- automotive systems
- embedded industrial
- instrumentation
- video/image analysis
- biometric
- power/motor control applications
| 수량 | 단가(참고용) | 총액 |
|---|---|---|
| 1+ | $ 10.2662 | $ 10.27 |
| 10+ | $ 8.8063 | $ 88.06 |
| 30+ | $ 7.9167 | $ 237.50 |
| 100+ | $ 7.1705 | $ 717.05 |
표준 패키지189/Full Tray | ||
제품 사양
| 타입 | 설명 | |
|---|---|---|
| 카테고리 | Integrated Circuits (ICs)/Embedded/DSP (Digital Signal Processors) | |
| 제조업체 | ADI | |
| 포장 | CSPBGA-184(12x12) | |
| Operating Temperature | -40℃~+105℃ | |
| Features | Hardware MAC acceleration;Zero-overhead loop;Circular buffer support;DMA data transfer;High-speed peripheral interface;Integrated ADC interface;Integrated PWM control;Interrupt response;Secure storage and protection;RTC and timer | |
| Clock Rate | 300MHz |
| 타입 | 설명 | |
|---|---|---|
| 카테고리 | Integrated Circuits (ICs)/Embedded/DSP (Digital Signal Processors) | |
| 제조업체 | ADI | |
| 포장 | CSPBGA-184(12x12) |
| 타입 | 설명 | |
|---|---|---|
| Operating Temperature | -40℃~+105℃ | |
| Features | Hardware MAC acceleration;Zero-overhead loop;Circular buffer support;DMA data transfer;High-speed peripheral interface;Integrated ADC interface;Integrated PWM control;Interrupt response;Secure storage and protection;RTC and timer | |
| Clock Rate | 300MHz |
개요
The ADSP-BF70x processor is a member of the Blackfin family of products. The Blackfin processor combines a dualMAC 16-bit state-of-the-art signal processing engine, the advantages of a clean, orthogonal RISC-like microprocessor instruction set, and single-instruction, multiple-data (SIMD) multimedia capabilities into a single instruction-set architecture. New enhancements to the Blackfin + core add 32-bit MAC and 16-bit complex MAC support, cache enhancements, branch prediction and other instruction set improvements—all while maintaining instruction set compatibility to previous Blackfin products. The processor offers performance up to 400 MHz, as well as low static power consumption. Produced with a low-power and lowvoltage design methodology, they provide world-class power management and performance. By integrating a rich set of industry-leading system peripherals and memory, the Blackfin processor is the platform of choice for next-generation applications that require RISC-like programmability, multimedia support, and leadingedge signal processing in one integrated package. These applications span a wide array of markets, from automotive systems to embedded industrial, instrumentation, video/image analysis, biometric and power/motor control applications.
주요 특징
- Blackfin + core with up to 400 MHz performance
- Dual 16-bit or single 32-bit MAC support per cycle
- 16-bit complex MAC and many other instruction set enhancements
- Instruction set compatible with previous Blackfin products
- Low-cost packaging 88-Lead LFCSP_VQ (QFN) package (12 mm×12 mm), RoHS compliant
- 184-Ball CSP_BGA package 12 mm×12 mm×0.8 mm pitch, RoHS compliant
- Low system power with <100 mW core domain power at 400 MHz (μ<0.25 mW/MHz) at 25℃ TJUNCTION
- AEC-Q100 qualified for automotive applications
- 136 kB L1 SRAM with multi-parity-bit protection (64 kB instruction, 64 kB data, 8 kB scratchpad)
- Large on-chip L2 SRAM with ECC protection 256 kB, 512 kB, 1 MB variants
- On-chip L2 ROM (512 kB)
- L3 interface (CSP_BGA only) optimized for lowest system power, providing 16-bit interface to DDR2 or LPDDR DRAM devices (up to 200 MHz)
- Security and one-time-programmable memory
- Crypto hardware accelerators
- Fast secure boot for IP protection
- memDMA encryption/decryption for fast run-time security
응용 분야
- automotive systems
- embedded industrial
- instrumentation
- video/image analysis
- biometric
- power/motor control applications
C654470 EasyEDA 라이브러리
컴플라이언스 & 수출 코드
| 타입 | 세부사항 |
|---|---|
| RoHS | ROHS3 Compliant |
| ECCN | 5A992C |
| CNHTS | 8542319090 |
| USHTS | |
| TARIC | |
| CAHTS | |
| BRHTS | |
| INHTS | |
| MXHTS |
| 타입 | 세부사항 |
|---|---|
| RoHS | ROHS3 Compliant |
| ECCN | 5A992C |
| CNHTS | 8542319090 |
| USHTS | |
| TARIC |
| 타입 | 세부사항 |
|---|---|
| CAHTS | |
| BRHTS | |
| INHTS | |
| MXHTS | |

