Alliance Memory AS7C1026B-12TCNTR

The AS7C1026B is a high-performance CMOS 1,048,576-bit Static Random Access Memory (SRAM) device organized as 65,536 words x 16 bits. It is designed for memory applications where fast data access, low power, and simple interfacing are desired. Equal address access and cycle times (tAA, tRC, tWC) of 10/12/15/20 ns with output enable access times Δ[tOE] of 5, 6, 7, 8 ns are ideal for high-performance applications. When CE is high, the device enters standby mode. If inputs are still toggling, the device will consume ISB power. If the bus is static, then full standby power is reached (ISB1). For example, the AS7C1026B is guaranteed not to exceed 55 mW under nominal full standby conditions. A write cycle is accomplished by asserting write enable (WE) and chip enable (CE). Data on the input pins I/O0 through I/O15 is written on the rising edge of WE (write cycle 1) or CE (write cycle 2). To avoid bus contention, external devices should drive I/O pins only after outputs have been disabled with output enable (OE) or write enable (WE). A read cycle is accomplished by asserting output enable (OE) and chip enable (CE) with write enable (WE) high. The chip drives I/O pins with the data word referenced by the input address. When either chip enable or output enable is inactive or write enable is active, output drivers stay in high-impedance mode. The device provides multiple center power and ground pins, and separate byte enable controls, allowing individual bytes to be written and read. LB controls the lower bits, I/O0 through I/O7, and UB controls the higher bits, I/O8 through I/O15. All chip inputs and outputs are TTL-compatible, and operation is from a single 5 V supply. The device is packaged in common industry standard packages.

• Industrial and commercial versions
• Organization: 65,536 words x 16 bits
• Center power and ground pins for low noise
• High speed - 10/12/15/20 ns address access time - 5, 6, 7, 8 ns output enable access time
• Low power consumption: ACTIVE - 605 mW / max @ 10 ns
• Low power consumption: STANDBY - 55 mW / max CMOS I/O
• 6 T 0.18 u CMOS technology
• Easy memory expansion with CE, OE inputs
• TTL-compatible, three-state I/O
• JEDEC standard packaging - 44-pin 400 mil SOJ - 44-pin TSOP 2-400
• ESD protection ≥2000 volts
• Latch-up current ≥200 mA