Fair-Rite 2508051218Y3

Multilayer chip beads provide a cost-effective solution for suppressing conducted EMI signals. These beads are suitable for a wide range of devices such as mobile phones, computers, laptops, and pagers. The small form factor package facilitates automated placement and allows for high-density board population. Beads are available in standard, high-speed, and gigahertz signal speed versions. All multilayer chip beads are offered in tape and reel packaging, with bulk packaging available upon request. The recommended land pattern conforms to the latest revision of IPC-7351. Weight is 0.002 grams. Package size is 0402 (1005). Listed impedance values are typical; nominal impedance is specified at 100 MHz with a tolerance of ±25%. Beads are measured using an HP 4291A with fixture HP 16192A for impedance measurement. All beads undergo 100% impedance and DC resistance testing.

• Standard, high-speed, and gigahertz signal speed versions available
• Small form factor package for automated placement and high-density PCB assembly
• All products available in tape-and-reel packaging
• Recommended land pattern compliant with IPC-7351
• Weight: 0.002 g
• Package size: 0402 (1005)
• Impedance specified at 100 MHz with ±25% tolerance
• Impedance measured using HP 4291A with fixture HP 16192A
• 100% impedance and DC resistance tested

• Mobile phones
• Computers
• Laptops
• Pagers