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TI LMV1032URX-15/NOPB

Producent
Nr części prod.
LMV1032URX-15/NOPB
Nr LCSC
C2864540
Opak.
DSBGA-4
Numer Klienta
Klucz. cechy
60uA 1.7V~5V 1-Channel DSBGA-4 Audio Amplifiers RoHS
Karta KatalogowaTI LMV1032URX-15/NOPB
Zgodność z RoHS1 dokumentów dostępnych
Brak w magazynie
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Minimum: 1Wielokrotność: 1Jednostka sprzedaży: Piece
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Szt.Cena jedn.(Tylko do wglądu)Suma całkowita
1+$ 2.2625$ 2.26
200+$ 0.8752$ 175.04
500+$ 0.8451$ 422.55
1,000+$ 0.8292$ 829.20
Standardowa Obudowa3000/Full Reel
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Specyfikacje Produktu

Wszystko
TypOpis
KategoriaIntegrated Circuits (ICs)/Linear/Amplifiers/Audio Amplifiers
ProducentTI
Opak.DSBGA-4
Quiescent Current60uA
Voltage - Supply1.7V~5V
Total Harmonic Distortion + Noise (THD+N)-
Features-
Operating Temperature-40℃~+85℃
Number of Inputs-
Signal-to-Noise Ratio61dB
Speaker Channels1-Channel
Efficiency-
Output Power-
Class-
Power Supply Rejection Ratio (PSRR)70dB

Opis

Tłumaczenie AI

The LMV1032s are an audio amplifier series for small form factor electret microphones. They are designed to replace the JFET preamp currently being used. The LMV1032 series is ideal for extended battery life applications, such as a Bluetooth communication link. The addition of a third pin to an electret microphones that incorporates an LMV1032 allows for a dramatic reduction in supply current as compared to the JFET equipped electret microphone. Microphone supply current is thus reduced to 60 μA, assuring longer battery life. The LMV1032 series is specified for supply voltages from 1.7V to 5V, and has fixed voltage gains of 6 dB, 15 dB and 25 dB. The devices are offered in space saving 4-bump ultra thin DSBGA lead free packages and are thus ideally suited for the form factor of miniature electret microphone packages. These extremely miniature packages have the Large Dome Bump (LDB) technology. This DSBGA technology is designed for microphone PCBs requiring 1 kg adhesion criteria.

Funkcje

Tłumaczenie AI
  • Output Voltage Noise (A-weighted): −89 dBV
  • Low Supply Current: 60 μA
  • Supply Voltage: 1.7V to 5V
  • PSRR: 70 dB
  • Signal to Noise Ratio: 61 dB
  • Input Capacitance: 2 pF
  • Input Impedance: >100 MΩ
  • Output Impedance: <200 Ω
  • Max Input Signal: 170 mVpp
  • Temperature Range: -40°C to 85°C
  • Large Dome 4-Bump DSBGA Package with Improved Adhesion Technology

Zastosowania

Tłumaczenie AI
  • Mobile Communications - Bluetooth
  • Automotive Accessories
  • Cellular Phones
  • PDAs
  • Accessory Microphone Products