ROHM KTR03EZPF

This specification defines the high voltage resistor chip resistors "KTR03 EZP" manufactured by ROHM Co., Ltd.

• Cover tape peel strength: 0.1N ≤ peel strength ≤ 0.6N
• When the cover tape is peeled off, the base tape shall not adhere to the cover tape; peeling direction as shown below
• After exposure to 60±3°C, 90~95% RH environment for 120 hours, the cover tape shall not detach from the base tape
• Components shall be placed in the tape pockets with the same side facing up (resistor paste side up)
• Cumulative pitch tolerance for 10 pitches shall be within ±0.2mm
• When the tape is bent at a radius of 15mm, the tape and pockets shall remain undamaged
• Components in the tape pockets shall not adhere to the bottom tape/cover tape
• When removing components from the pockets, components shall not be obstructed by tape fragments or foreign matter
• The cover tape shall not overlap the sprocket holes of the tape
• The number of missing components shall not exceed 0.1% of the total component count (marked quantity) or 1 piece (whichever is greater), and no more than two consecutive missing components are permitted
• Tape feed direction shall be as illustrated in the figure below
• The leader tape is the section containing only the cover tape and empty pockets (no resistors)
• The trailer tape is the section with empty pockets (no resistors); the trailer tape shall not be secured to the reel with adhesive and must be of the type that can be easily pulled out from the reel