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MICROCHIP ATSAML11D14A-MU

Hersteller
Herst.-Teilenr.
ATSAML11D14A-MU
LCSC-Nr.
C1338121
Verp.
VQFN-24-EP(4x4)
Kundennummer
Hauptmerkm.
ARM Cortex-M23 32 Bit 32MHz VQFN-24-EP(4x4) Microcontrollers RoHS
DatenblattMICROCHIP ATSAML11D14A-MU
RoHS-Konformität2 Dokumente verfügbar
Alternativteile20
Nicht vorrätig
Benachrichtigen
Minimum: 1Vielfaches: 1Verkaufseinheit: Piece
Zur BOM-Liste hinzufügen
Stk.E-Preis(Nur als Referenz)Gesamtbetrag
1+$ 2.3926$ 2.39
200+$ 0.9256$ 185.12
490+$ 0.8932$ 437.67
980+$ 0.877$ 859.46
Standardgehäuse490/Full Tray
Besserer Preis bei größerer Menge?
$

Produktspezifikationen

Alle
TypBeschreibung
KategorieIntegrated Circuits (ICs)/Embedded/Microcontrollers
HerstellerMICROCHIP
Verp.VQFN-24-EP(4x4)
DAC (Bit)10bit
ADC (Bit)12bit
Number of I/O17
Operating Temperature-40℃~+85℃
Program Memory TypeFLASH
Voltage - Supply1.62V~3.63V
EEPROM2KB
Program Storage Size16KB
CPU CoreARM Cortex-M23
Core Size32 Bit
CPU Maximum Speed32MHz
Oscillator TypeBuilt-in

Merkmale

KI-Übersetzung
  • Operating Conditions: 1.62V to 3.63V, -40°C to +125°C, DC to 32 MHz
  • Core: 32 MHz (2.64 CoreMark/MHz and up to 31 DMIPS) Arm Cortex -M23 with:
    • Single-cycle hardware multiplier
    • Hardware divider
    • Nested Vector Interrupt Controller (NVIC)
    • Memory Protection Unit (MPU)
    • Stack Limit Checking
    • TrustZone for ARMv8-M (optional)
  • Memory:
    • 16/32/64-KB Flash
    • 4/8/16-KB SRAM
    • 2-KB Data Flash Write-While-Read (WWR) section for non-volatile data storage
    • 256 bytes TrustRAM with physical protection features
  • Clock Management:
    • Flexible clock distribution optimized for low power
    • 32.768 kHz crystal oscillator
    • 32.768 kHz ultra low-power internal RC oscillator
    • 0.4 to 32 MHz crystal oscillator
    • 16/12/8/4 MHz low-power internal RC oscillator
    • Ultra low-power digital Frequency-Locked Loop (DFLLULP)
    • 32-96 MHz fractional digital Phase-Locked Loop (FDPLL96M)
    • One frequency meter
  • Low-Power and Power Management:
    • Active, Idle, Standby with partial or full SRAM retention and off sleep modes:
      • Active mode (<25 μA/MHz)
      • Idle mode (<10 μA/MHz) with 1.5 μs wake-up time
      • Standby with Full SRAM Retention (0.5 μA) with 5.3 μs wake-up time
      • Off mode (<100 nA)
    • Static and dynamic power gating architecture
    • Sleepwalking peripherals
    • Two performance levels
    • Embedded Buck/LDO regulator with on-the-fly selection
  • Security:
    • Up to four tamper pins for static and dynamic intrusion detections
    • Data Flash:
      • Optimized for secure storage
      • Address and data scrambling with user-defined key (optional)
      • Rapid tamper erase on scrambling key and on one user-defined row
      • Silent access for data read noise reduction
  • TrustRAM:
    • Address and data scrambling with user-defined key
    • Chip-level tamper detection on physical RAM to resist microprobing attacks
    • Rapid tamper erase on scrambling key and RAM data
    • Silent access for data read noise reduction
    • Data remanence prevention
  • Peripherals:
    • One True Random Generator (TRNG)
    • AES-128, SHA-256, and GCM cryptography accelerators (optional)
    • Secure pin multiplexing to isolate on dedicated I/O pins a secured communication with external devices from the non-secure application (optional)
    • TrustZone for flexible hardware isolation of memories and peripherals (optional):
      • Up to six regions for the Flash
      • Up to two regions for the Data Flash
      • Up to two regions for the SRAM
      • Individual security attribution for each peripheral, I/O, external interrupt line, and Event System Channel
    • Secure Boot with SHA-based authentication (optional)
    • Up to three debug access levels
    • Up to three Chip Erase commands to erase part of or the entire embedded memories
    • Unique 128-bit serial number
    • SAM L11 Securely Key Provisioned (KPH) (optional):
      • Key Provisioning using Root of Trust flow
      • Security Software Framework using Kinibi-M Software Development Kit (SDK)
  • Advanced Analog and Touch:
    • One 12-bit 1 Msps Analog-to-Digital Converter (ADC) with up to 10 channels
    • Two Analog Comparators (AC) with window compare function
    • One 10-bit 350 ksps Digital-to-Analog Converter (DAC) with external and internal outputs
    • Three Operational Amplifiers (OPAMP)
    • Up to 20 self-capacitance channels
    • Up to 100 (10x10) mutual-capacitance channels
    • Low-power, high-sensitivity, environmentally robust capacitive touch buttons, sliders, and wheels
    • Hardware noise filtering and noise signal desynchronization for high conducted immunity
    • Driven Shield Plus for better noise immunity and moisture tolerance
    • Parallel Acquisition through Polarity control
    • Supports wake-up on touch from Standby Sleep mode
  • Communication Interfaces:
    • Up to three Serial Communication Interfaces (SERCOM) that can operate as:
      • USART with full-duplex and single-wire half-duplex configuration
      • I²C up to 3.4 Mbit/s (High-Speed mode) on one instance and up to 1 Mbit/s (Fast-mode Plus) on the second instance
      • Serial Peripheral Interface (SPI)
      • ISO7816 on one instance (Available on 32-pin packages only)
      • RS-485 on one instance (Available on 32-pin packages only)
      • LIN Client on one instance (Available on 32-pin packages only)
  • Timers/Output Compare/Input Capture:
    • Three 16-bit Timers/Counters (TC), each configurable as:
      • One 16-bit TC with two compare/capture channels
      • One 8-bit TC with two compare/capture channels
      • One 32-bit TC with two compare/capture channels, by using two TCs
    • PWM Modes using TC peripherals:
      • Up to two PWM channels on each 16-bit TC
    • 32-bit Real-Time Counter (RTC) with clock/calendar functions
    • Watchdog Timer (WDT) with Window mode
  • Input/Output (I/O):
    • Up to 25 programmable I/O lines
    • Eight external interrupts (EIC)
    • One non-maskable interrupt (NMI)
    • One Configurable Custom Logic (CCL) that supports:
      • Combinatorial logic functions, such as AND, NAND, OR, and NOR
      • Sequential logic functions, such as Flip-Flop and Latches
  • Qualification and Class-B Support:
    • AEC-Q100 Grade 1 (-40°C to +125°C)
    • Class-B safety library, IEC 60730 (future)
  • Debugger Development Support:
    • Two-pin Serial Wire Debug (SWD) programming and debugging interface

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