ChromeLED CDDC30B1W

Produttore	ChromeLED
Cod. Prod.	CDDC30B1W
Cod. LCSC	C5963976
Imballo	DIP-10
Numero Cliente
Attr. chiave	Blue 2 120mW Common Cathode 0.3 DIP-10 LED Character and Numeric RoHS
Scheda Tecnica	ChromeLED CDDC30B1W

Specifiche del Prodotto

Tutto

Tipo	Descrizione
Categoria	Optoelectronics/LED Character and Numeric
Produttore	ChromeLED
Imballo	DIP-10
Illumination Color	Blue
Number of Characters	2
Display Type	7 Segment
Pd - Power Dissipation	120mW
LED Polarity	Common Cathode
Operating Temperature	-40℃~+85℃
Height	-
Digit/Alpha Size(inch)	0.3
Width	-
Length	-
Forward Voltage Drop	3.5V
Light Intensity	2mcd

Tipo	Descrizione
Categoria	Optoelectronics/LED Character and Numeric
Produttore	ChromeLED
Imballo	DIP-10
Illumination Color	Blue
Number of Characters	2
Display Type	7 Segment
Pd - Power Dissipation	120mW
LED Polarity	Common Cathode

Traduzione AI

Forward current vs. forward voltage; forward current vs. ambient temperature; luminous intensity vs. ambient temperature

Traduzione AI

Solder no closer than 3mm from the base of the epoxy bulb; soldering beyond the tie bar base is recommended.
Follow the recommended soldering conditions.
Do not apply any stress to the leads, especially during heating.
Do not reposition the LED after soldering.
After soldering, protect the epoxy bulb from mechanical shock or vibration until the LED returns to room temperature.
Direct soldering to a PC board should be avoided. PC board warpage or clamping and cutting of the lead frame may cause mechanical stress to the resin. If this is truly necessary, the user assumes responsibility for any issues. Direct soldering should only be performed after testing confirms that no damage such as wire bond failure or resin degradation will occur. LEDs should not be soldered directly to double-sided PC boards, as heat may degrade the epoxy resin.
When clamping the LED to prevent soldering failure, it is important to minimize mechanical stress on the LED.
Cut the LED lead frame at room temperature. Cutting the lead frame at elevated temperatures may cause LED failure.

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Tutto

Tipo	Descrizione
Categoria	Optoelectronics/LED Character and Numeric
Produttore	ChromeLED
Imballo	DIP-10
Illumination Color	Blue
Number of Characters	2
Display Type	7 Segment
Pd - Power Dissipation	120mW
LED Polarity	Common Cathode
Operating Temperature	-40℃~+85℃
Height	-
Digit/Alpha Size(inch)	0.3
Width	-
Length	-
Forward Voltage Drop	3.5V
Light Intensity	2mcd

Tipo	Descrizione
Categoria	Optoelectronics/LED Character and Numeric
Produttore	ChromeLED
Imballo	DIP-10
Illumination Color	Blue
Number of Characters	2
Display Type	7 Segment
Pd - Power Dissipation	120mW
LED Polarity	Common Cathode

Traduzione AI

Forward current vs. forward voltage; forward current vs. ambient temperature; luminous intensity vs. ambient temperature

Traduzione AI

Solder no closer than 3mm from the base of the epoxy bulb; soldering beyond the tie bar base is recommended.
Follow the recommended soldering conditions.
Do not apply any stress to the leads, especially during heating.
Do not reposition the LED after soldering.
After soldering, protect the epoxy bulb from mechanical shock or vibration until the LED returns to room temperature.
Direct soldering to a PC board should be avoided. PC board warpage or clamping and cutting of the lead frame may cause mechanical stress to the resin. If this is truly necessary, the user assumes responsibility for any issues. Direct soldering should only be performed after testing confirms that no damage such as wire bond failure or resin degradation will occur. LEDs should not be soldered directly to double-sided PC boards, as heat may degrade the epoxy resin.
When clamping the LED to prevent soldering failure, it is important to minimize mechanical stress on the LED.
Cut the LED lead frame at room temperature. Cutting the lead frame at elevated temperatures may cause LED failure.