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VICOR BCM6123TD1E5117T00

Hersteller
Herst.-Teilenr.
BCM6123TD1E5117T00
LCSC-Nr.
C6470264
Verp.
-
Kundennummer
Hauptmerkm.
DC DC Converters RoHS
DatenblattVICOR BCM6123TD1E5117T00
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Minimum: 1Vielfaches: 1Verkaufseinheit: Piece
Zur BOM-Liste hinzufügen
Stk.E-Preis(Nur als Referenz)Gesamtbetrag
1+$ 157.3574$ 157.36
Standardgehäuse25/Full Tray
Besserer Preis bei größerer Menge?
$

Beschreibung

KI-Übersetzung

The BCM6123xD1E5116yzz Bus Converter is a high efficiency Sine Amplitude Converter, operating from a 260 to 410VDC primary bus to deliver an isolated, ratiometric secondary voltage from 32.5 to 51.3VDC. The BCM6123xD1E5116yzz offers low noise, fast transient response, and industry leading efficiency and power density. In addition, it provides an AC impedance beyond the bandwidth of most downstream regulators, allowing input capacitance normally located at the input of a PoL regulator to be located at the primary side of the BCM module. With a primary to secondary K factor of 1/8, that capacitance value can be reduced by a factor of 64x, resulting in savings of board area, material and total system cost. Leveraging the thermal and density benefits of Vicor’s ChiP packaging technology, the BCM module offers flexible thermal management options with very low top and bottom side thermal impedances. Thermally-adept ChiP-based power components, enable customers to achieve low cost power system solutions with previously unattainable system size, weight and efficiency attributes, quickly and predictably. This product can operate in reverse direction, at full rated power, after being previously started in forward direction.

Merkmale

KI-Übersetzung
  • Up to 16.9A continuous secondary current
  • Up to 1250W/in3 power density
  • 97.7% peak efficiency
  • 4,242VDC isolation
  • Parallel operation for multi-kW arrays
  • OV, OC, UV, short circuit and thermal protection
  • 6123 through-hole ChiP package (2.494"×0.898"×0.286" 63.34mm×22.80mm×7.26mm)
  • PMBus management interface

Anwendungen

KI-Übersetzung
  • 380VDC Power Distribution
  • High End Computing Systems
  • Automated Test Equipment
  • Industrial Systems
  • High Density Power Supplies
  • Communications Systems
  • Transportation