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MICROCHIP MCP47FEB02A1T-E/ST product image
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MICROCHIP MCP47FEB02A1T-E/ST

Hersteller
Herst.-Teilenr.
MCP47FEB02A1T-E/ST
LCSC-Nr.
C627348
Verp.
TSSOP-8
Kundennummer
Hauptmerkm.
6us 2.7V~5.5V 0.5LSB 8 I2C TSSOP-8 Digital to Analog Converters (DAC) RoHS
DatenblattMICROCHIP MCP47FEB02A1T-E/ST
RoHS-Konformität2 Dokumente verfügbar
Nicht vorrätig
Benachrichtigen
Minimum: 1Vielfaches: 1Verkaufseinheit: Piece
Zur BOM-Liste hinzufügen
Stk.E-Preis(Nur als Referenz)Gesamtbetrag
1+$ 0.9918$ 0.99
10+$ 0.8222$ 8.22
30+$ 0.7281$ 21.84
100+$ 0.6232$ 62.32
500+$ 0.5769$ 288.45
1,000+$ 0.5553$ 555.30
Standardgehäuse2500/Full Reel
Besserer Preis bei größerer Menge?
$

Produktspezifikationen

Alle
TypBeschreibung
KategorieIntegrated Circuits (ICs)/Data Acquisition/Digital to Analog Converters (DAC)
HerstellerMICROCHIP
Verp.TSSOP-8
Settling Time6us
Operating Temperature-40℃~+125℃
Voltage - Supply2.7V~5.5V
FunctionBuilt-in reference source;Programmable gain;Integrated buffer;Power-on reset;Power-down mode
Integral non - linearity0.5LSB
Resolution (Bits)8
Interface TypeI2C

Beschreibung

KI-Übersetzung

The MCP47FEBXX are Single- and Dual-channel 8-bit, 10-bit, and 12-bit buffered voltage output Digital-toAnalog Converters (DAC) with nonvolatile memory and an I²C serial interface. The VREF pin, the device VDD or the internal band gap voltage can be selected as the DAC’s reference voltage. When VDD is selected, VDD is connected internally to the DAC reference circuit. When the VREF pin is used, the user can select the output buffer’s gain to be 1 or 2. When the gain is 2, the VREF pin voltage should be limited to a maximum of VDD/2. These devices have a two-wire I²C-compatible serial interface for Standard (100 kHz), Fast (400 kHz) or High-Speed (1.7 MHz and 3.4 MHz) modes.

Merkmale

KI-Übersetzung
  • Operating Voltage Range: - 2.7V to 5.5V - Full Specifications - 1.8V to 2.7V - Reduced Device Specifications
  • Output Voltage Resolutions: - 8-bit: MCP47FEB0X (256 Steps) - 10-bit: MCP47FEB1X (1024 Steps) - 12-bit: MCP47FEB2X (4096 Steps)
  • Rail-to-Rail Output
  • Fast Settling Time of 6 µs (typical)
  • DAC Voltage Reference Source Options: - Device VDD - External VREF pin (buffered or unbuffered) - Internal Band Gap (1.22V typical)
  • Output Gain Options: - Unity (1x) - 2x (when not using internal VDD as voltage source)
  • Nonvolatile Memory (EEPROM): - User-programmed Power-on Reset (POR)/Brown-out Reset (BOR) output setting recall and device configuration bits - Auto Recall of Saved DAC register setting - Auto Recall of Saved Device Configuration (Voltage Reference, Gain, Power-Down)
  • Power-on/Brown-out Reset Protection
  • Nonvolatile Memory Write Protect (WP) Bit
  • Power-Down Modes: - Disconnects output buffer (High Impedance) - Selection of V0UT pull-down resistors (100 kΩ or 1 kΩ)
  • Low Power Consumption: - Normal operation: <180 μA (Single), 380 μA (Dual) - Power-down operation: 650 nA typical - EEPROM write cycle (1.9 mA maximum)
  • I2C Interface: - Slave address options: four predefined addresses or user programmable (all 7 bits) - Standard (100 kbps), Fast (400 kbps), and High-Speed (up to 3.4 Mbps) modes
  • Package Types: 8-lead TSSOP
  • Extended Temperature Range: -40°C to +125°C

Anwendungen

KI-Übersetzung
  • Set Point or Offset Trimming
  • Sensor Calibration
  • Low-Power Portable Instrumentation
  • PC Peripherals
  • Data Acquisition Systems
  • Motor Control