ST CAM-5G1-160CLR

The CAM-55G1 ready-to-use modules are a complete family of sample camera modules designed for seamless evaluation and integration of the VD55G1 560K-pixel monochrome image sensor. These plug-and-play vision expansion modules integrate the VD55G1 image sensor, lens holder, lens, and plug-and-play flexible connection in a compact package as small as 5.0mm square. The CAM-55G1 family fully leverages the complete on-chip features embedded in the VD55G1 image sensor, such as auto-exposure, auto-wake-up, background subtraction, and event-triggered modes. Multiple GPIOs allow users to synchronize modules via triggers and illumination. The ready-to-use module features a single-lane MIPI CSI-2 output and ultra-low operating power consumption, making it ideal for embedded low-power devices. Multiple ready-to-use module variants are available with different lenses to best match various application requirements in terms of optical configuration and mechanical constraints. All camera modules share the same FPC-to-board connector and pin assignment. This plug-and-play architecture allows users to instantly swap ready-to-use modules and reuse different lenses, color options, or even different image sensors from the ST BrightSense portfolio under the same setup. CAM-55G1 ready-to-use modules can be tested and integrated on a PC or embedded processing board using hardware and software tools provided by ST. Compatible EVK Main and P-Board hardware kits support direct connection to a PC and embedded processing platforms, respectively. The evaluation GUI software and Linux drivers are available for download from the Imaging Software section of the website.

• Pre-mounted modules available: ready-to-use camera modules for evaluation, integrating the VD55G1 image sensor, lens holder, lens, and plug-and-play flex connector. Lenses are focused, bonded, and tested using dedicated equipment in a cleanroom environment. Footprint as small as 5.0mm square, with smaller sizes achievable through customized solutions via partner camera module integrators.
• High lens flexibility: ultra-wide-angle lens for wide scene capture (160° DFOV); highly compact lens for miniaturized modules (81° DFOV, clear filter); lens optimized for accurate near-infrared image sensing (80° DFOV, 940 nm bandpass filter).
• Plug-and-play connector for easy pre-mounted module replacement: FPC-to-board 30-pin connector, shared across all STMicroelectronics pre-mounted modules.
• Streamlined evaluation and integration: evaluate on a computer with USB output using the EVK Main hardware tool and free evaluation GUI software; or on an embedded processing platform with MIPI CSI-2 output using the P-Board hardware tool and free Linux software tools.