TI TPA6166A2YFFR

A single-chip headset interface IC enables easy detection of devices inserted into the headphone jack by end users, while delivering excellent audio quality. This device integrates a high-performance, low-power DirectPath variable attenuation Class G stereo headphone amplifier, a variable-gain microphone preamplifier with bias circuitry, and advanced accessory detection circuitry — all in a compact 5mm×5mm pin, 0.4mm pitch WCSP package — helping to reduce the overall footprint of the end product. The Class G headphone amplifier adjusts the supply voltage of the headphone amplifier based on the audio signal level, maximizing battery life. With 8μV output noise (at 0dB) and 91dB PSRR, the headphone amplifier delivers exceptional audio performance. DirectPath eliminates the need for DC-blocking capacitors. The headphone preamplifier offers two programmable gain settings (12dB and 24dB) and 3.4μV input-referred noise. The headset bias voltage has two programmable settings: 2V and 2.6V. The bias output can drive up to 1.2mA of current, and features 2μV low output noise and 92dB PSRR, providing excellent power supply noise rejection for wireless headsets. The advanced accessory detection algorithm automatically detects 6 supported accessory types and can enable or disable internal components accordingly.

• Ultra-low power, high-performance DirectPath Class-G headphone amplifier
• Ground-centered output eliminates DC-blocking capacitors
• 30mW per channel (32Ω/channel) at 1% THD+N
• –42dB to +6dB volume control
• Output noise of 2.0μV at –42dB gain
• 91dB PSRR
• Ground loop rejection circuit for reduced crosstalk
• Fully differential microphone preamplifier with variable gain and 3.4μV low noise
• Integrated AC-coupling capacitors
• Ground loop rejection circuit for reduced crosstalk between headphone and microphone
• Two selectable microphone bias voltages: 2.0V and 2.6V
• 92dB PSRR
• Integrated programmable microphone bias resistor
• Advanced accessory insertion, removal, and type detection
• Passive multi-button support via 10-bit SAR ADC
• Proprietary scheme to reduce false triggers caused by audio playback signals in the presence of finite resistance on the headset ground return path
• 4-level IEC ESD protection integrated on jack connection pins (on EVM)
• Ultra-low power chip shutdown mode
• I2C interface

• Smartphones and wireless earbuds
• Portable tablets
• Laptops and docking stations