Wave soldering is one of the most widely used techniques in PCB assembly, yet soldering defects remain one of the most common challenges that can impact the quality and reliability of the final product. These defects include bridging solder, incomplete…
What Is PCB Tombstoning? Tombstoning PCB, also known as the Manhattan effect or crocodile effect, is a common defect in Surface-Mount Technology (SMT) assemblies. It occurs when one end of a surface-mounted component lifts vertically from the PCB during reflow…
In the manufacturing process of electronic devices, the PCB board, being a critical component, can be affected by environmental factors during use. To enhance the reliability and extend the lifespan of PCB boards, conformal coating is a common solution that…
A Simple LED to an Innovative Idea In the world of hardware development, countless groundbreaking ideas often originate from something as humble as an LED. As one of the most fundamental electronic components, an LED is far more than just…
In the PCBA manufacturing process, precise component placement is critical to ensure optimal circuit board performance and reliability. Fiducial marks (optical alignment points) are essential reference points on PCBs, enabling accurate positioning throughout the pick-and-place process. This article provides a…
In surface mount technology (SMT), different components require varying amounts of solder paste for optimal soldering. Traditional laser stencils regulate paste deposition by adjusting aperture sizes. However, some PCB designs demand precise thickness variations in different areas. Step stencils address…
The Impact of Stencil Aperture Design on Soldering Quality The aperture size is generally adjusted based on the actual size of the PCB pads to precisely control the solder paste volume in the solder paste printing process. Solder Ball Prevention…
Exposed Pad Soldering and PCB Heat Management Guide With modern electronic devices getting smaller, effective thermal management is more critical than ever. High-density PCB designs often face serious heat dissipation challenges, especially when using QFN (Quad Flat No-lead) packages. Unlike…
The proper design of thermal relief pads optimizes soldering and improves heat management, reducing defects. However, designers often face challenges in designing and using these pads, as well as selecting the right substrate materials. This article explains the principles and…
Optimization for Solder Paste Printing Process to Reduce Solder Ball Formation During the solder paste printing process, a series of advanced techniques ensures quality and reduces solder ball formation when employed. The implementation of precise control over the solder paste…
