MICROCHIP MXSMBJ17CA/TR

The MSMB 5.0A through MSMB 170CA series of surface mount 600 watt transient voltage suppressors provide a selection of stand-of voltages (VW M) from 5.0 to 170V. These high-reliability devices are available in either unidirectional or bidirectional versions. The SMBG Gull-wing design in the DO-215AA package is ideal for visible solder connections. The SMBJ J-bend design in the DO-214AA package allows for greater PC board mounting density. It is available with SnPb or RoHS compliant matte-tin plating. These are available with a variety of upscreening options for enhanced reliability. They can protect against the secondary efects of lightning per IEC61000-4-5 and against voltage pulses from inductive switching environments and induced by RF radiation. Since their response time is virtually instantaneous, they can also be used in protection from ESD and EFT per IEC61000-4-2 and IEC61000-4-4.

• High reliability devices with wafer fabrication and assembly lot traceability for all M prefx devices.
• All devices 100% surge tested
• Enhanced reliability screening in reference to MIL-PRF-19500 is also available.
• Suppress transients up to 600W at 10/1000 µs
• Moisture classifcation is Level 1 with no dry pack required per IPC/JEDEC J-STD-020F for all M prefx devices.
• 3σ lot norm screening performed on standby current (ID) for all M prefx devices
• RoHS compliant versions available

• Protects sensitive components such as IC’s, CMOS, Bipolar, BiCMOS, ECL, DTL, T2L, and so on
• Protection from switching transients and RF induced voltage pulses
• Protection from ESD and EFT per IEC 61000-4-2 and IEC 61000-4-4
• Secondary lightning protection per IEC61000-4-5 with 42 ohms source impedance: Class 1: MSB 5.0A to MSMB 120CA Class 2: MSMB 5.0A to MSMB 60CA Class 3: MSMB 5.0A to MSMB 30CA Class 4: MSMB 5.0A to MSMB 15CA
• Secondary lightning protection per IEC61000-4-5 with 12 ohms source impedance: Class 1: MSMB 5.0A to MSMB 36CA Class 2: MSMB 5.0A to MSMB 18CA