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MICROCHIP ATWINC1510-MR210UB

Fabricante
N.º de pieza fab.
ATWINC1510-MR210UB
Nº LCSC
C6508792
Emb.
SMD
Número de Cliente
Atrib. clave
802.11 b/g/n IoT Module
Hoja de DatosMICROCHIP ATWINC1510-MR210UB
Garantía en cada pedido
100% Auténtico · Devolución o Reemplazo en 30 Días
En stock: 3
3 En stock, envío inmediato
Mínimo: 1Múltiplo: 1Unidad de venta: Piece
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Cant.Prec. unit.Importo total
1+$ 15.7594$ 15.76
10+$ 15.3802$ 153.80
Encapsulado Estándar1/Full Tray
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Especificaciones del Producto

Todo
TipoDescripción
CategoríaRF and Wireless/RF Transceiver Modules and Modems
FabricanteMICROCHIP
Emb.SMD
Frequency Range2.4GHz
Voltage - Supply3V~4.2V
Utilized IC / PartATWINC1510B
Output Power19.5dBm
Sensitivity-98dBm
Receive Current52.5mA
FeaturesWi-Fi direct
InterfaceSPI;UART
Operating Temperature-40℃~+85℃
Current Of Transmitting294mA

Descripción

Traducción por IA

The ATWINC15x0-MR210xB is a low power consumption 802.11 b/g/n IoT (Internet of Things) module, specifically optimized for low power IoT applications. The module integrates Power Amplifier (PA), Low-Noise Amplifier (LNA), Switch, Power Management, and a printed antenna or a micro co-ax (u.FL) connector for an external antenna resulting in a small form factor (21.7×14.7×2.1 mm) design. It is interoperable with various vendors’ 802.11 b/g/n access points. This module provides SPI ports to interface with a host controller.

Características

Traducción por IA
  • IEEE 802.11 b/g/n 20 MHz (1x1) solution
  • Single spatial stream in 2.4 GHz ISM band
  • Integrated Transmit/Receive switch
  • Integrated PCB antenna or u.FL micro co-ax connector for external antenna
  • Superior sensitivity and range via advanced PHY signal processing
  • Advanced equalization and channel estimation
  • Advanced carrier and timing synchronization
  • Wi-Fi Direct (supported till firmware release 19.5.2)
  • Soft-AP support
  • Supports IEEE 802.11 WEP, WPA, WPA2 security
  • Support Enterprise security with WPA/WPA2 (802.1X)
    • EAP-TLS
    • EAP-PEAPv0/1 with TLS
    • EAP-TTLSv0 with MSCHAPv2
    • EAP-PEAPv0/1 with MSCHAPv2
  • Superior MAC throughput via hardware accelerated two-level A-MSDU/A-MPDU frame aggregation and block acknowledgment
  • On-chip memory management engine to reduce host load
  • SPI host interface
  • Operating temperature range from -40℃ to +85℃. RF performance at room temperature of 25℃ with a 2 - 3 db change at boundary conditions
  • I/O operating voltage of 2.7V to 3.6V
  • Built-in 26 MHz crystal
  • Integrated Flash memory for system software
  • Power Save modes
    • 4 μA Power-Down mode typical at 3.3V I/O
    • 380 μA Doze mode with chip settings preserved (used for beacon monitoring)
    • On-chip low power sleep oscillator
    • Fast host wake-up from Doze mode by a pin or SPI transaction
  • Fast Boot options
    • On-chip boot ROM (Firmware instant boot)
    • SPI flash boot
    • Low-leakage on-chip memory for state variables
    • Fast AP re-association (150 ms)
  • On-chip Network stack to offload MCU
    • Integrated Network IP stack to minimize host CPU requirements
    • Network features TCP, UDP, DHCP, ARP, HTTP, TLS, and DNS
    • Hardware accelerators for Wi-Fi and TLS security to improve connection time
    • Hardware accelerator for IP checksum
  • Hardware accelerators for OTA security
  • Small footprint host driver
  • Wi-Fi Alliance certifications for Connectivity and Optimizations
    • ID: WFA61069