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RENESAS R5F571MLGDFC#10

Fabricante
Cód. da peça
R5F571MLGDFC#10
Nº LCSC
C3230153
Emb.
LFQFP-176(24x24)
Número do Cliente
Atrib. princ.
RXv2 32 Bit 240MHz LFQFP-176(24x24) Microcontrollers RoHS
Folha de DadosRENESAS R5F571MLGDFC#10
Peças alternativas5
Garantia em cada pedido
100% Autêntico · Devolução ou Substituição em 30 Dias

Especificações do Produto

Tudo
TipoDescrição
CategoriaIntegrated Circuits (ICs)/Embedded/Microcontrollers
FabricanteRENESAS
Emb.LFQFP-176(24x24)
DAC (Bit)12bit
ADC (Bit)12bit
Number of I/O127
Operating Temperature-40℃~+85℃
Program Memory TypeFLASH
Voltage - Supply2.7V~3.6V
Program Storage Size4MB
EEPROM64KB
CPU CoreRXv2
Core Size32 Bit
CPU Maximum Speed240MHz
Oscillator TypeBuilt-in

Descrição

Tradução por IA

240-MHz 32-bit RX MCU, on-chip FPU, 480 DMIPS, up to 4-MB flash memory, 512-KB SRAM, various communications interfaces including IEEE 1588-compliant Ethernet MAC, high-speed USB 2.0 with battery charging, SD host interface (optional), quad SPI, and CAN, 12-bit A/D converter, RTC, encryption (optional), serial interface for audio, CMOS camera interface

Recursos

Tradução por IA
  • 32-bit RXv2 CPU core
    • Max. operating frequency: 240 MHz Capable of 480 DMIPS in operation at 240 MHz
    • Single precision 32-bit IEEE-754 floating point
    • Two types of multiply-and-accumulation unit (between memories and between registers)
    • 32-bit multiplier (fastest instruction execution takes one CPU clock cycle)
    • Divider (fastest instruction execution takes two CPU clock cycles)
    • Fast interrupt
    • CISC Harvard architecture with 5-stage pipeline
    • Variable-length instructions: Ultra-compact code
    • Supports the memory protection unit (MPU)
    • JTAG and FINE (one-line) debugging interfaces
  • Low-power design and architecture
    • Operation from a single 2.7- to 3.6-V supply
    • Low power consumption: A product that supports all peripheral functions draws only 0.2 mA/MHz (Typ.)
    • RTC is capable of operation from a dedicated power supply
    • Four low-power modes
  • On-chip code flash memory
    • Supports versions with up to 4 Mbytes of ROM
    • No wait states at up to 120 MHz or when the AFU is hit, one wait state at above 120 MHz and when the AFU is missed
    • User code is programmable by on-board or off-board programming
    • Programming/erasing as background operations (BGOs)
  • On-chip data flash memory
    • 64 Kbytes, reprogrammable up to 100,000 times
    • Programming/erasing as background operations (BGOs)
  • On-chip SRAM
    • 512 Kbytes of SRAM (no wait states except in the 256 Kbytes from 0004 0000h to 0007 FFFFh when ICLK is set to 120 MHz or faster)
    • 32 Kbytes of RAM with ECC (single-error correction and double error detection)
    • 8 Kbytes of standby RAM (backup on deep software standby)
  • Data transfer
    • DMAC: 8 channels
    • DTC
    • EXDMAC: 2 channels
    • DMAC for the Ethernet controller: 3 channels for 176- and 177-pin products; 2 channels for 100-, 144-, and 145-pin products
  • Reset and supply management
    • Power-on reset (POR)
    • Low voltage detection (LVD) with voltage settings
  • Clock functions
    • External crystal resonator or internal PLL for operation at 8 to 24 MHz
    • Internal 240-kHz LOCO and HOCO selectable from 16, 18, and 20 MHz
    • 120-kHz clock for the IWDTa
  • Real-time clock
    • Adjustment functions (30 seconds, leap year, and error)
    • Real-time clock counting and binary counting modes are selectable
    • Time capture function (for capturing times in response to event-signal input)
  • Independent watchdog timer
    • Useful functions for IEC60730 compliance
    • Oscillation-stoppage detection, frequency measurement, CRC, IWDTa, self-diagnostic function for the A/D converter, etc.
    • Register write protection function can protect values in important registers against overwriting
  • Various communications interfaces
    • IEEE 1588-compliant Ethernet MAC (for 176- and 177-pin products: 2 modules)
    • PHY layer for host/function or OTG controller (1) with high-speed USB 2.0 with battery charging transfer (only for 176- and 177-pin products)
    • PHY layer (1) for host/function or OTG controller (1) with fullspeed USB 2.0 transfer
    • CAN (compliant with ISO11898-1), incorporating 32 mailboxes (up to 3 modules)
    • SCIg and SCIh with multiple functionalities (up to 9) Choose from among asynchronous mode, clock-synchronous mode, smart-card interface mode, simplified SPI, simplified I²C, and extended serial mode
    • SCIFA with 16-byte transmission and reception FIFOs (up to 4 interfaces)
    • I²C bus interface for transfer at up to 1 Mbps (up to 2 interfaces)
    • Four-wire QSPI (1 interface) in addition to RSPIa (2 interfaces)
    • Parallel data capture unit (PDC) for the CMOS camera interface (not in 100-pin products)
    • SD host interface (optional: 1 interface) with a 1- or 4-bit SD bus for use with SD memory or SDIO
    • MMCIF with 1-, 4-, or 8-bit transfer bus width
  • External address space
    • Buses for full-speed data transfer (max. operating frequency of 60 MHz)
    • 8 CS areas
    • 8-, 16-, or 32-bit bus space is selectable per area
    • Independent SDRAM area (128 Mbytes)
  • Up to 29 extended-function timers
    • 16-bit TPUa, MTU3a, and GPTA: input capture, output compare, PWM waveform output
    • 8-bit TMRa (4 channels), 16-bit CMT (4 channels), 32-bit CMTW (2 channels)
  • 12-bit A/D converter
    • Two 12-bit units (8 channels for unit 0; 21 channels for unit 1)
    • Self diagnosis
    • Detection of analog input disconnection
  • 12-bit D/A converter: 2 channels
    • On-chip operational amplifier output or direct input selectable
  • Temperature sensor for measuring temperature within the chip