Luminus Devices CBM-120-UV-C31-FB365-21

Luminus LEDs benefit from innovations in device technology, chip packaging, and thermal management. These technologies enable engineers and system designers to develop high-power, high-efficiency solutions. Luminus's vertical chip technology delivers uniform luminance across the entire chip surface. These densely arrayed device configurations generate optical power and brightness levels that enable solutions beyond the reach of single-chip packages, serving as replacements for arc lamps and halogen lamps. Thermal management is critical in high-power LED applications. The Luminus CBM-120 LED achieves a junction-to-heatsink thermal resistance of 0.6℃/W — the lowest among all UV LEDs on the market. This allows the LED to be driven at higher current densities while maintaining a lower junction temperature, resulting in greater brightness and extended service life. Luminus LEDs undergo rigorous environmental and mechanical stress testing — including mechanical shock, vibration, thermal cycling, and humidity testing — making them suitable for extreme high-power and high-current applications with extremely low failure rates and a median lifetime exceeding 30,000 hours. All Luminus LED products comply with RoHS and halogen-free standards, and are free of hazardous substances such as lead and mercury.

• Mosaic array UV LED die array, 12 mm² emitting area, 4:3 aspect ratio
• All benefits of chip-on-board processing without complex assembly
• Vertical chip UV LED technology for high power density and uniform emission
• Broad UVA wavelength coverage
• High thermal conductivity copper core board packaging
• Low-profile window for efficient coupling into small étendue systems
• Operates at variable drive currents up to 18A
• NIST-traceable optical and electrical measurement testing
• Environmentally friendly: RoHS compliant and halogen-free

Curing (ink, coating, adhesive), inspection, machine vision, fiber-coupled illumination, dedicated projection systems for maskless lithography