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TTM Technologies, Inc. A1101R09C00GR

Produttore
Cod. Prod.
A1101R09C00GR
Cod. LCSC
C6109678
Imballo
BLGA-24
Numero Cliente
Attr. chiave
-112dBm SPI BLGA-24 RF Transceiver Modules and Modems RoHS
Scheda TecnicaTTM Technologies, Inc. A1101R09C00GR
Garanzia su ogni ordine
100% Autentico · Reso o Sostituzione entro 30 Giorni
Esaurito
Avvisami
Minimo: 1Multiplo: 1Unità di vendita: Piece
Aggiungi alla Lista BOM
QtàPr. unit.(Solo per riferimento)Importo totale
1+$ 42.6766$ 42.68
200+$ 17.0281$ 3405.62
500+$ 16.4599$ 8229.95
Package Standard500/Full Reel
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Specifiche del Prodotto

Tutto
TipoDescrizione
CategoriaRF and Wireless/RF Transceiver Modules and Modems
ProduttoreTTM Technologies, Inc.
ImballoBLGA-24
Model-
Output Power(Max)10dBm
Frequency Range902MHz;928MHz
Voltage - Supply1.8V~3.6V
Antenna Type-
Sensitivity-112dBm
Communication Distance-
Modulation System-
Receive Current15mA
InterfaceSPI
FeaturesIntegrated temperature sensor;Integrated balun;Integrated phase-locked loop
Operating Temperature-40℃~+85℃
Current Of Transmitting-

Descrizione

Traduzione AI

The A1101R09C is a high-performance, FCC & IC certified connectorized radio module that incorporates the Texas Instruments CC1101 transceiver chip in the industry’s smallest package (9×12×2.5mm) and is compatible with all TI-approved software stacks. With an LGA pad footprint and industry-standard U.FL button connector receptacle, this module is designed to effortlessly integrate into a wide range of applications, including: industrial control, building automation, low-power wireless sensor networks, lighting control, and automated meter reading. The A1101R09C has an RoHS-compliant ENIG finish and is packaged on tape & reel or in matrix trays for high-volume automated manufacturing.

Caratteristiche

Traduzione AI
  • Frequency range: 902 - 928 MHz
  • FCC & IC compliant, shielded package
  • FCC ID: X7J - A10040601 // IC: 8975A - A10040601
  • Digital RSSI output
  • Programmable output power up to +10 dBm
  • High sensitivity (1.2 kBaud, 1% packet error rate) -112 dBm at 915 MHz (compliant to FCC/IC)
  • Ultra-small package size: 9×12×2.5 mm
  • Industry-standard U.FL connector
  • LGA footprint
  • RoHS compliant
  • Operating temperature -40 to +85 °C
  • Impedance-controlled, multi-layer PCB
  • 1.8 to 3.6 VDC
  • Low current consumption (15 mA in RX, 1.2 kBaud, 915 MHz)
  • 200 nA sleep mode current consumption
  • Efficient SPI interface; all registers can be programmed with one “burst” transfer
  • Available in tape & reel and matrix tray
  • Module weight approximately 0.4 grams

Applicazioni

Traduzione AI
  • industrial control
  • building automation
  • low-power wireless sensor networks
  • lighting control
  • automated meter reading