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Infineon S25HL01GTDPMHI010

Producent
Nr części prod.
S25HL01GTDPMHI010
Nr LCSC
C6998415
Opak.
SOIC-16-300mil
Numer Klienta
Klucz. cechy
1Gbit 2.7V~3.6V 166MHz SPI SOIC-16-300mil Memory RoHS
Karta KatalogowaInfineon S25HL01GTDPMHI010
Części alternatywne5
Gwarancja na każde zamówienie
100% Oryginalne · Zwrot lub Wymiana w ciągu 30 Dni
Brak w magazynie
Powiadom mnie
Minimum: 1Wielokrotność: 1Jednostka sprzedaży: Piece
Dodaj do Listy BOM
Szt.Cena jedn.(Tylko do wglądu)Suma całkowita
1+$ 28.4368$ 28.44
240+$ 11.3478$ 2723.47
480+$ 10.9678$ 5264.54
960+$ 10.7801$ 10348.90
Standardowa Obudowa240/Full Tray
Lepsza cena za większą ilość?
$

Specyfikacje Produktu

Wszystko
TypOpis
KategoriaIntegrated Circuits (ICs)/Memory/Memory
ProducentInfineon
Opak.SOIC-16-300mil
Operating Temperature-40℃~+85℃
FeaturesPower-on reset;ECC error correction
Memory Size1Gbit
Voltage - Supply2.7V~3.6V
Program / Erase Cycles2,560,000 Cycles
Clock Frequency166MHz
Data Retention - TDR (Year)25 Years
Block Erase Time(tBE)-
Write Cycle Time(tWC)-
Page Programming Time (Tpp)-
Standby Supply Current14uA
InterfaceSPI

Funkcje

Tłumaczenie AI
  • Infineon 45nm MIRRORBIT technology, storing two data bits per memory array cell
  • Sector architecture options: uniform, hybrid configuration 1, hybrid configuration 2
  • Page program buffer: 256 or 512 bytes
  • OTP security silicon array: 1024 bytes (32 × 32 bytes)
  • Quad SPI: supports 1S-1S-4S, 1S-4S-4S, 1S-4D-4D, 4S-4S-4S, 4S-4D-4D protocols; SDR option up to 83 MBps (166 MHz clock speed); DDR option up to 102 MBps (102 MHz clock speed)
  • Dual SPI: supports 1S-2S-2S protocol; SDR option up to 41.5 MBps (166 MHz clock speed)
  • SPI: supports 1S-1S-1S protocol; SDR option up to 21 MBps (166 MHz clock speed)
  • Functional safety features: functional safety NOR flash compliant with ISO 26262 ASIL B and ASIL D ready; Infineon Endurance Flex architecture provides high endurance and long retention partitions; data integrity CRC detects errors in memory array; SafeBoot reports device initialization failures, detects configuration corruption, and provides recovery options; built-in ECC corrects single-bit errors and detects double-bit errors in memory array data (SECDED); sector erase status indicator for power loss during erase
  • Protection features: legacy block protection for memory array and device configuration; advanced sector protection based on individual memory array sectors
  • AutoBoot enables immediate memory array access after power-up
  • Hardware reset via JEDEC serial flash reset signaling protocol / dedicated RESET# pin / DQ3_RESET# pin
  • Serial Flash Discoverable Parameters (SFDP) describe device functions and features
  • Device ID, manufacturer ID, and identification

Części alternatywne

MPNProducentTyp alternatywnyOpakowanieDostępnośćCena jednostkowa
MX66L1G45GMI-08GMXICPodobneSOIC-16-300mil54$ 58.8922
MT25QL01GBBB8ESF-0SITmicronPodobneSO-16-300mil5$ 47.6969
S70FL01GSAGMFI013Infineon/CYPRESSPodobneSOIC-16-300mil3$ 16.2638
W25Q01JVSFIQWinbondPodobneSOIC-16-300mil60$ 44.8501
S70FL01GSAGMFI011Infineon/CYPRESSPodobneSOIC-16-300mil8$ 16.8261