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muRata 935156422522-T3S

Hersteller
Herst.-Teilenr.
935156422522-T3S
LCSC-Nr.
C20041449
Verp.
-
Kundennummer
Hauptmerkm.
11V 22nF Silicon Capacitors RoHS
DatenblattmuRata 935156422522-T3S
RoHS-Konformität5 Dokumente verfügbar
Garantie auf jede Bestellung
100% Authentisch · 30-Tage-Rückgabe oder -Umtausch
Nicht vorrätig
Benachrichtigen
Minimum: 1Vielfaches: 1Verkaufseinheit: Piece
Zur BOM-Liste hinzufügen
Stk.E-Preis(Nur als Referenz)Gesamtbetrag
1+$ 1.5476$ 1.55
200+$ 0.6175$ 123.50
500+$ 0.5969$ 298.45
1,000+$ 0.5873$ 587.30
Standardgehäuse1000/Full Reel
Besserer Preis bei größerer Menge?
$

Produktspezifikationen

Alle
TypBeschreibung
KategoriePassives/Capacitors/Silicon Capacitors
HerstellermuRata
Verp.-
operating temperature-55℃~+150℃
Voltage - Breakdown11V
Capacitance22nF

Beschreibung

KI-Übersetzung

XBSC/UBSC/BBSC/ULSC capacitors are designed for optical communication systems (ROSA/TOSA, SONET, and all optoelectronic devices) as well as high-speed data systems or products. These capacitors are specifically designed for DC blocking, coupling, and bypass-to-ground applications. Murata Integrated Passive Solutions' unique silicon integrated passive device technology enables the XBSC to deliver low insertion loss, low reflection, and high phase stability from 16 kHz to 110 GHz; the UBSC from 16 kHz to 67 GHz; the BBSC from 16 kHz to 40 GHz; and the ULSC from 16 kHz to 20 GHz. These deep-trench silicon capacitors are fabricated using semiconductor MOS processes, offering very high reliability and capacitance stability under voltage variations (0.1%/V) and temperature changes (60 ppm/K). Their operating temperature range extends from -55°C to 150°C. The use of a fully controlled production line with high-temperature curing (above 900°C) produces high-purity oxides, resulting in reliable and repeatable performance. The XBSC/UBSC/BBSC/ULSC series complies with JEDEC assembly guidelines, making these products fully compatible with high-speed automated pick-and-place manufacturing operations. These capacitors are RoHS compliant and, depending on size, are available with ENIG termination or lead-free pre-bumping.

Merkmale

KI-Übersetzung
  • Ultra-wideband performance up to 110 GHz
  • Resonance-free, enabling ultra-low group delay variation
  • Ultra-low insertion loss due to excellent impedance matching in transmission mode
  • Low ESL and low ESR in bypass-to-ground mode
  • High capacitance stability over temperature, voltage, and aging
  • High reliability
  • Compatible with lead-free reflow soldering

Anwendungen

KI-Übersetzung
  • Optoelectronics/High-Speed Data
  • Transimpedance Amplifiers (TIA)
  • Receiver and Transmitter Optical Sub-Assemblies (ROSA/TOSA)
  • Synchronous Optical Network (SONET)
  • High-Speed Digital Logic
  • Broadband Test Equipment
  • Broadband Microwave/Millimeter-Wave
  • X7R and NPO Capacitor Replacement
  • Thin-Profile Applications (400 or 100 μm)