ADI AD648KNZ

The AD648 is a matched pair of low power, precision monolithic op amps. It combines low bias current (10 pA max after warm-up) with low quiescent current (400 μA max), and is fabricated using ion-implanted FETs and laser wafer trimming. The AD648 guarantees input bias current over the entire common-mode voltage range. The economical J grade guarantees a maximum offset voltage of 2 mV and offset voltage drift of 20 μV/°C. This level of DC accuracy is achieved through Analog Devices' laser wafer drift trimming process. The combination of low quiescent current and low offset voltage drift minimizes input offset voltage changes due to self-heating effects. The product is available in five grades covering commercial and industrial temperature ranges. The AD648 is recommended for any dual-supply op amp application requiring low power consumption along with excellent DC and AC performance. In applications such as battery-powered precision instrument front ends and CMOS DAC buffers, the AD648's outstanding combination of low input offset voltage and drift, low bias current, and low 1/f noise reduces output errors. High CMRR (82 dB min for the "B" grade) and high open-loop gain ensure better than 12-bit linearity in high-impedance buffer applications. The AD648 is available in a standard dual op amp pinout in seven performance grades. The AD648J and AD648K are specified for the commercial temperature range of 0°C to 70°C. The AD648A and AD648B are specified for the industrial temperature range of -40°C to +85°C. The AD648S and AD648T are specified for the -55°C to +125°C temperature range, and the AD648T* grade is processed to MIL-STD-883B, Revision C. The AD648 is available in 8-pin plastic mini-DIP, CERDIP, and SOIC packages.

• DC Performance: 400 μA max quiescent current
• 10 pA max bias current after warm-up (AD648B)
• μV max offset voltage (AD648B)
• 10 μV/°C max drift (AD648B)
• μV peak-to-peak noise, 0.7 Hz to 70 Hz
• AC Performance: 1.8 V/μs slew rate
• 1 MHz unity-gain bandwidth
• Available in plastic mini-DIP, CERDIP, and plastic SOIC packages
• MIL-STD-883B compliant versions available
• SOIC surface-mount package available in EIA-481A standard tape-and-reel packaging

• Battery-powered precision instrument front-ends
• CMOS DAC buffers
• High-impedance buffer applications