TI SN74AUP2G02DCUR

The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire V_CC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity. The SN74AUP2G02 performs the Boolean function Y = (A + B) (overline) or Y = A (overline) · B (overline) in positive logic. NanoStar package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using I_Off. The I_Off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

• Available in NanoStar package
• Low static power consumption, Icc max 0.9μA
• Low dynamic power consumption, Cpd typical 4.3pF at 3.3V
• Low input capacitance, typical 1.5pF
• Low noise, overshoot and undershoot less than 10% of Vcc
• Ioff supports partial power-down mode operation
• Wide operating voltage range: 0.8V~3.6V
• Optimized for 3.3V operation
• Supports 3.6V I/O tolerance for mixed-voltage signal operation
• tpd max 4.3ns at 3.3V
• Latch-up performance exceeds 100mA, compliant with JESD 78 Class II
• ESD performance compliant with JESD 22: 2000V Human Body Model Class II and 1000V Charged Device Model

• Battery-powered portable devices
• Point-to-point applications