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MICROCHIP CDLL5953B/TR

Hersteller
Herst.-Teilenr.
CDLL5953B/TR
LCSC-Nr.
C3765571
Verp.
DO-213AB
Kundennummer
Hauptmerkm.
1 Independent 150V DO-213AB Single Zener Diodes RoHS
DatenblattMICROCHIP CDLL5953B/TR
RoHS-Konformität2 Dokumente verfügbar
Garantie auf jede Bestellung
100% Authentisch · 30-Tage-Rückgabe oder -Umtausch
Nicht vorrätig
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Minimum: 1Vielfaches: 1Verkaufseinheit: Piece
Zur BOM-Liste hinzufügen
Stk.E-Preis(Nur als Referenz)Gesamtbetrag
1+$ 8.5255$ 8.53
200+$ 3.2995$ 659.90
500+$ 3.1838$ 1591.90
1,000+$ 3.1267$ 3126.70
Standardgehäuse1/Full Reel
Besserer Preis bei größerer Menge?
$

Produktspezifikationen

Alle
TypBeschreibung
KategorieDiscrete Semiconductors/Diodes/Zener/Single Zener Diodes
HerstellerMICROCHIP
Verp.DO-213AB
Diode Configuration1 Independent
Tolerance±5%
Operating Junction Temperature Range-65℃~+175℃
Pd - Power Dissipation1.25W
Reverse Leakage Current (Ir)1uA@114V
Impedance(Zzt)600Ω
Zener Voltage(Range)-
Zener Voltage(Nom)150V
Impedance(Zzk)6kΩ

Beschreibung

KI-Übersetzung

This series of 1.5W surface mount Zener diodes in JEDEC DO-213AB package offers electrical characteristics similar to JEDEC-registered 1N5913B through 1N5956B axial-lead packages (3.3V to 200V). It is ideal for high-density and low-parasitics applications. Due to its glass-sealed construction and metallurgically enhanced internal contacts, it is also suitable for high-reliability applications when required by source control drawings (SCD) or screened per MIL-PRF-19500 as described in the characteristics below.

Merkmale

KI-Übersetzung
  • Surface-mount equivalent to JEDEC-registered 1N5913B–1N5956B series axial-lead diodes.
  • Zener voltage range: 3.3V to 200V.
  • Voltage tolerances of 10%, 5%, 2%, and 1% available.
  • Screenable to MIL-PRF-19500. (See part numbering for all available options.)
  • RoHS-compliant versions available.

Anwendungen

KI-Übersetzung
  • Voltage regulation across wide operating current and temperature ranges.
  • Leadless package ideal for high-density SMT.
  • Metallurgically enhanced internal contact design for improved reliability and reduced thermal resistance.
  • Glass-sealed hermetic package construction.
  • Insensitive to ESD per MIL-STD-750 Method 1020.