NXP MIMXRT117FDVMAA

The i.MX RT1170 is a new high-end processor of the i.MX RT family, which features NXP’s advanced implementation of a high performance Arm Cortex -M7 core operating at speeds up to 1 GHz and a power efficient Cortex -M4 core up to 400 MHz. The i.MX RT1170 processor has 2 MB on-chip RAM in total, including a 768 KB RAM which can be flexibly configured as TCM (512 KB RAM shared with M7 TCM and 256 KB RAM shared with M4 TCM) or general-purpose on-chip RAM. The i.MX RT1170 integrates advanced power management module with DCDC and LDO regulators that reduce complexity of external power supply and simplifies power sequencing. The i.MX RT1170 also provides various memory interfaces, including SDRAM, RAW NAND FLASH, NOR FLASH, SD/eMMC, Quad/Octal SPI, Hyper RAM/Flash, and a wide range of other interfaces for connecting peripherals, such as WLAN, Bluetooth, GPS, displays, and camera sensors. The i.MX RT1170 also has rich audio and video features, including MIPI CSI/DSI, LCD display, graphic accelerator, camera interface, SPDIF, and I2S audio interface.

• The Arm Cortex-M7 Core Platform:
  • 32 KB L1 Instruction Cache and 32 KB L1 Data Cache
  • Floating Point Unit (FPU) with single-precision and double-precision support of Armv7-M Architecture FPv5
  • Support the Arm v7-M Thumb instruction set, defined in the Armv7-M architecture Integrated Memory Protection Unit (MPU), up to 16 individual protection regions
  • Up to 512 KB I-TCM and D-TCM in total
  • Frequency of 1 GHz with Forward Body Biasing (FBB)
• The Arm Cortex -M4 Core platform:
  • Cortex-M4 processor with single-precision FPU defined by Armv7-M architecture FPv4-SP
  • Integrated MPU with 8 individual protection regions
  • 16 KB Instruction Cache, 16 KB Data Cache, and 256 KB TCM
  • Frequency of 400 MHz without body biasing
• The SoC-level memory system consists of the following additional components:
  • Boot ROM (256 KB)
  • On-chip RAM (2 MB in total)
  • Configurable 512 KB RAM shared with M7 TCM
  • 256 KB RAM shared with M4 TCM
  • Dedicated 1.25 MB OCRAM
  • Secure always-on RAM (4 KB)
• External memory interfaces:
  • 8/16/32-bit SDRAM, up to SDRAM-133/SDRAM-166/SDRAM-200
  • 8/16-bit SLC NAND FLASH
  • SD/eMMC
  • SPI NOR/NAND FLASH
  • Parallel NOR FLASH with XIP support
  • Single/Dual channel Quad SPI FLASH with XIP support
  • Hyper RAM/FLASH
  • OCT FLASH
  • Synchronization mode for all devices
• Timers and PWMs:
  • Six General Programmable Timer (GPT) modules
  • Two Periodical Interrupt Timer (PIT) modules
  • Four Quad Timer (QTimer) modules
  • Four FlexPWMs
  • Four Quadrature Decoders
  • Four Watch Dog (WDOG) modules
• Each i.MX RT1170 processor enables the following interfaces to external devices:
  • Display Interface:
    • Parallel RGB LCD interface (eLCDIF)
    • Parallel RGB LCD Interface Version 2 (LCDIFv2)
    • MIPI Display Serial Interface (MIPI DSI)
    • Smart LCD Display with 8080 interface through SEMC
  • Audio:
    • SPDIF input and output
    • Four Synchronous Audio Interface (SAI) modules supporting I2S, AC97, TDM, and codec/DSP interfaces
    • Medium Quality Sound (MQS) interface via GPIO pads
    • PDM microphone interface with 4 pairs of inputs
    • Asynchronous Sample Rate Converter (ASRC)
  • Graphics engine:
    • Generic 2D (PXP)
    • Vector Graphics Processing

• Industrial Human Machine Interfaces (HMI)
• Motor Control
• Home Appliance
• High-end Audio Appliance
• Low-end Instrument Cluster
• Point-of-Sale (PoS)