LCSC Electronics logoLCSC Electronics svg logo
Accedi
USD
Infineon/CYPRESS CY14B101LA-ZS45XI product image
Immagini a scopo illustrativo

Infineon/CYPRESS CY14B101LA-ZS45XI

Produttore
Cod. Prod.
CY14B101LA-ZS45XI
Cod. LCSC
C2950163
Imballo
TSOP-44
Numero Cliente
Attr. chiave
TSOP-44 Memory
Scheda TecnicaInfineon/CYPRESS CY14B101LA-ZS45XI
Garanzia su ogni ordine
100% Autentico · Reso o Sostituzione entro 30 Giorni
Esaurito
Avvisami
Minimo: 1Multiplo: 1Unità di vendita: Piece
Aggiungi alla Lista BOM
QtàPr. unit.(Solo per riferimento)Importo totale
1+$ 1.916$ 1.92
270+$ 0.7425$ 200.48
540+$ 0.7165$ 386.91
1,080+$ 0.7035$ 759.78
Package Standard270/Full Tray
Prezzo migliore per quantità maggiore?
$

Specifiche del Prodotto

Tutto
TipoDescrizione
CategoriaIntegrated Circuits (ICs)/Memory/Memory
ProduttoreInfineon/CYPRESS
ImballoTSOP-44

Descrizione

Traduzione AI

The Cypress CY14B101LA/CY14B101NA is a fast static RAM (SRAM), with a nonvolatile element in each memory cell. The memory is organized as 128 K bytes of 8 bits each or 64 K words of 16 bits each. The embedded nonvolatile elements incorporate QuantumTrap technology. The SRAM provides infinite read and write cycles, while independent nonvolatile data resides in the highly reliable QuantumTrap cell. Data transfers from the SRAM to the nonvolatile elements (the STORE operation) takes place automatically at power-down. On power-up, data is restored to the SRAM (the RECALL operation) from the nonvolatile memory. Both the STORE and RECALL operations are also available under software control.

Caratteristiche

Traduzione AI
  • 20 ns, 25 ns, and 45 ns access times
  • Internally organized as 128 Kx8 (CY14B101LA) or 64 Kx16 (CY14B101NA)
  • Hands off automatic STORE on power-down with only a small capacitor
  • STORE to QuantumTrap nonvolatile elements initiated by software, device pin, or AutoStore on power-down
  • RECALL to SRAM initiated by software or power-up
  • Infinite read, write, and RECALL cycles
  • 1 million STORE cycles to QuantumTrap
  • 20 year data retention
  • Single 3 V +20% to -10% operation
  • Industrial temperature
  • Packages: 32 -pin small-outline integrated circuit (SOIC), 44-/54-pin thin small outline package (TSOP) Type II, 48-pin shrink small-outline package (SSOP), 48-ball fine-pitch ball grid array (FBGA)
  • Pb-free and restriction of hazardous substances (RoHS) compliant