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MICROCHIP ATWINC1500-MR210UB

제조업체
MICROCHIP
제조사 품번
ATWINC1500-MR210UB
LCSC 번호
C115089
포장
-
고객 번호
주요 제원
2.4GHz RF Transceiver Modules and Modems RoHS
데이터시트MICROCHIP ATWINC1500-MR210UB
RoHS 준수1개 문서 이용 가능
모든 주문 보장
100% 정품 · 30일 반품 또는 교환
품절
재입고 알림
최소값: 1배수: 1판매 단위: Piece
BOM 목록에 추가
수량단가(참고용)총액
1+$ 17.6679$ 17.67
10+$ 17.27$ 172.70
표준 패키지50/Full Tray
수량이 많을수록 더 좋은 가격?
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제품 사양

전체
타입설명
카테고리RF and Wireless/RF Transceiver Modules and Modems
제조업체MICROCHIP
포장-
Frequency Range2.4GHz
Utilized IC / Part-
Output Power19.5dBm
FeaturesWi-Fi direct
InterfaceI2C;SPI;UART
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개요

AI 번역

The ATWINC15x0-MR210xB is a low power consumption 802.11 b/g/n IoT (Internet of Things) module, specifically optimized for low power IoT applications. The module integrates Power Amplifier (PA), Low-Noise Amplifier (LNA), Switch, Power Management, and a printed antenna or a micro co-ax (u.FL) connector for an external antenna resulting in a small form factor (21.7×14.7×2.1 mm) design. It is interoperable with various vendors’ 802.11 b/g/n access points. This module provides SPI ports to interface with a host controller.

주요 특징

AI 번역
  • IEEE 802.11 b/g/n 20 MHz (1x1) solution
  • Single spatial stream in 2.4 GHz ISM band
  • Integrated Transmit/Receive switch
  • Integrated PCB antenna or u.FL micro co-ax connector for external antenna
  • Superior sensitivity and range via advanced PHY signal processing
  • Advanced equalization and channel estimation
  • Advanced carrier and timing synchronization
  • Wi-Fi Direct (supported till firmware release 19.5.2)
  • Soft-AP support
  • Supports IEEE 802.11 WEP, WPA, WPA2 security
  • Superior MAC throughput via hardware accelerated two-level A-MSDU/A-MPDU frame aggregation and block acknowledgment
  • On-chip memory management engine to reduce host load
  • SPI host interface
  • Operating temperature range from -40°C to +85°C
  • RF performance at room temperature of 25°C with a 2 - 3 db change at boundary conditions
  • I/O operating voltage of 2.7V to 3.6V
  • Built-in 26 MHz crystal
  • Integrated Flash memory for system software
  • 4 μA Power-Down mode typical at 3.3V I/O
  • 380 μA Doze mode with chip settings preserved (used for beacon monitoring)
  • On-chip low power sleep oscillator
  • Fast host wake-up from Doze mode by a pin or SPI transaction
  • Fast Boot options: On-chip boot ROM (Firmware instant boot), SPI flash boot
  • Low-leakage on-chip memory for state variables
  • Fast AP re-association (150 ms)
  • On-chip Network stack to offload MCU
  • Integrated Network IP stack to minimize host CPU requirements
  • Network features TCP, UDP, DHCP, ARP, HTTP, TLS, and DNS
  • Hardware accelerators for Wi-Fi and TLS security to improve connection time
  • Hardware accelerator for IP checksum
  • Hardware accelerators for OTA security
  • Small footprint host driver
  • Wi-Fi Alliance certifications for Connectivity and Optimizations ID: WFA61069