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SILICON LABS ZGM230SA27HGN3R

Produttore
Cod. Prod.
ZGM230SA27HGN3R
Cod. LCSC
C20439174
Imballo
-
Numero Cliente
Attr. chiave
-108.1dBm RF Transceiver Modules and Modems RoHS
Scheda TecnicaSILICON LABS ZGM230SA27HGN3R
Garanzia su ogni ordine
100% Autentico · Reso o Sostituzione entro 30 Giorni
Disponibile: 3
3 Pronta consegna
Minimo: 1Multiplo: 1Unità di vendita: Piece
Aggiungi alla Lista BOM
QtàPr. unit.Importo totale
1+$ 17.5058$ 17.51
10+$ 17.024$ 170.24
Package Standard2500/Full Reel
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Specifiche del Prodotto

Tutto
TipoDescrizione
CategoriaRF and Wireless/RF Transceiver Modules and Modems
ProduttoreSILICON LABS
Imballo-
Model-
Frequency Range868.42MHz;869.85MHz;908.42MHz
Output Power(Max)14dBm
Antenna Type-
Current Of Transmitting10.5mA;13.3mA;20.5mA;30.1mA;10.7mA;13.5mA;20.8mA;30mA
Voltage - Supply1.8V~3.8V
Sensitivity-108.1dBm
Communication Distance-
Modulation SystemFSK;GFSK
Receive Current4.1mA;4.2mA;4.5mA;4.6mA
InterfaceUART;SPI;I2C;IrDA;I2S
FeaturesAES encryption;Built-in watchdog;Integrated temperature sensor
Operating Temperature-40℃~+85℃

Descrizione

Traduzione AI

The ZGM230S is a system-in-package (SiP) module for Z-Wave connectivity and networking built for the performance, security, and energy demands of the Smart Home. Based on the EFR32ZG23 SoC, it delivers robust RF performance, long-range, industry-leading security features, low-current consumption, a rich set of MCU peripherals, and ample memory, all in a 6.5×6.5 mm package. The ZGM230S is a complete solution supported by powerful and fully-upgradeable software, advanced development and debugging tools, and documentation that will simplify and minimize the development cycle, certification process, and deployment of your endproduct, helping to accelerate its time-to-market significantly.

Caratteristiche

Traduzione AI
  • Z-Wave connectivity
  • RF pin for external antenna
  • +14 dBm TX power
  • -109.8 dBm RX sensitivity @100 kbps
  • 32-bit ARM Cortex-M33 core at 39 MHz
  • 512/64 kB of Flash/RAM memory
  • Advanced security features
  • Rich set of MCU peripherals
  • Integrated DC-DC converter
  • 34 GPIO pins
  • -40 to 85 °C
  • 6.5 mm x 6.5 mm
  • Supported Protocols: Z-Wave, Z-Wave Long Range
  • Wireless System-on-Chip: Sub-GHz radio; TX power up to +14 dBm; 32-bit ARM Cortex-M33 with DSP instruction and floating-point unit for efficient signal processing; 512 kB flash program memory; 64 kB RAM data memory; Embedded Trace Macrocell (ETM) for advanced debugging
  • Receiver Performance: -109.9 dBm sensitivity at 9.6 kbps FSK, 868.42 MHz; -110 dBm sensitivity at 40 kbps FSK, 868.4 MHz; -108.6 dBm sensitivity at 100 kbps GFSK, 869.85 MHz; -109.3 dBm sensitivity at 9.6 kbps FSK, 908.42 MHz; -109.7 dBm sensitivity at 40 kbps FSK, 908.4 MHz; -108.1 dBm sensitivity at 100 kbps GFSK, 916 MHz; -109.8 dBm sensitivity at 100 kbps O-QPSK, 912 MHz
  • Current Consumption: 4.1 mA RX current at 9.6 kbps FSK, 868.42 MHz; 4.1 mA RX current at 100 kbps GFSK, 869.85 MHz; 4.1 mA RX current at 9.6 kbps FSK, 908.4 MHz; 4.1 mA RX current at 100 kbps GFSK, 916 MHz; 4.6 mA RX current at 100 kbps O-QPSK, 912 MHz; 10.7 mA TX current at 0 dBm, 916 MHz; 20.8 mA TX current at +10 dBm, 916 MHz; 30.0 mA TX current at +14 dBm, 916 MHz; 26 μA/MHz in Active Mode (EM0) at 39.0 MHz; 1.5 μA in Deep Sleep (EM2) at 64 kB RAM retention and RTC running from LFRCO; 0.7 μA in Shutoff Mode (EM4)
  • Operating Range: 1.8 to 3.8 V, -40 to +85 °C
  • Dimensions: 6.5 mm × 6.5 mm
  • Security: Hardware Cryptographic Acceleration for AES128/192/256, ChaCha20-Poly1305, SHA-1, SHA-2/256/384/512, ECDSA + ECDH(P-192, P-256, P-384, P-521), Ed25519 and Curve25519, J-PAKE, PBKDF2; True Random Number Generator (TRNG); ARM TrustZone; Secure Boot (Root of Trust Secure Loader); Secure Debug Unlock; DPA Countermeasures; Secure Key Management with PUF; Anti-Tamper; Secure Attestation
  • MCU Peripherals: 12-bit 1 Msps or 16-bit 76.9 ksps SAR Analog to Digital Converter (ADC); 2× Analog Comparator (ACMP); 2× Digital to Analog Converter (VDAC); Low-Energy Sensor Interface (LESENSE); 34 General Purpose I/O pins with output state retention and asynchronous interrupts; 8 Channel DMA Controller; 12 Channel Peripheral Reflex System (PRS); 4×16-bit Timer/Counter with 3 Compare/Capture/PWM channels; 1×32-bit Timer/Counter with 3 Compare/Capture/PWM channels; 32-bit Real Time Counter; 24-bit Low Energy Timer for waveform generation; 2× Watchdog Timer; 3× Enhanced Universal Synchronous/Asynchronous Receiver/Transmitter (EUSART); ↑× Universal Synchronous/Asynchronous Receiver/Transmitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I2S); 2×120 interface with SMBus support; Integrated Low-Energy LCD Controller supporting up to 80 segments; Die temperature sensor

Applicazioni

Traduzione AI
  • Smart Home
  • Security
  • Lighting
  • Building Automation