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SEMTECH RCLAMP3324T.TCT

Produttore
Cod. Prod.
RCLAMP3324T.TCT
Cod. LCSC
C780129
Imballo
UFDFN-6(1x1.7)
Numero Cliente
Attr. chiave
10.5VC Clamp ESD DIODE UFDFN-6(1x1.7)
Scheda TecnicaSEMTECH RCLAMP3324T.TCT
Conformità RoHS1 documenti disponibili
Garanzia su ogni ordine
100% Autentico · Reso o Sostituzione entro 30 Giorni
Esaurito
Avvisami
Minimo: 5Multiplo: 5Unità di vendita: Piece
Aggiungi alla Lista BOM
QtàPr. unit.(Solo per riferimento)Importo totale
5+$ 0.2687$ 1.34
50+$ 0.2109$ 10.55
150+$ 0.1861$ 27.92
500+$ 0.1552$ 77.60
3,000+$ 0.1414$ 424.20
6,000+$ 0.1331$ 798.60
Package Standard3000/Full Reel
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Specifiche del Prodotto

Tutto
TipoDescrizione
CategoriaCircuit Protection/Transient Voltage Suppressors (TVS)/TVS Diodes
ProduttoreSEMTECH
ImballoUFDFN-6(1x1.7)
Clamping Voltage10.5V
Operating Temperature-40℃~+125℃
Peak Pulse Current (Ipp)5A@8/20us
Peak Pulse Power Dissipation (Ppp)75W
Number of ChannelsFour channels
Voltage - Breakdown3.8V
typeESD
PolarityUnidirectional
Reverse Leakage Current (Ir)5nA
Reverse Stand-Off Voltage (Vrwm)3.3V

Descrizione

Traduzione AI

The RClamp3324T provides ESD protection for USB 3.0, HDMI 1.3/1.4, and other high-speed ports. It features high maximum ESD withstand voltage per IEC 61000-4-2: ±25kV contact discharge and ±30kV air discharge. The RClamp3324T is designed to minimize ESD peak clamping and TLP clamping. ESD peak clamping voltage is extremely low and approximately equal across all pins. Dynamic resistance as low as 0.35Ω (typical) is industry-leading. Typical capacitance per line to ground is approximately 0.40pF. This enables the RClamp3324T to be used in applications exceeding 5GHz without signal attenuation. These devices are fabricated using Semtech's proprietary low-voltage EPD technology, delivering outstanding performance at operating voltages up to 3.3V. Each device protects up to four lines (two pairs of high-speed lines). The RClamp3324T comes in a 6-pin SLP1710P4T package. It measures 1.7×1.0mm with a nominal height of 0.40mm. Nominal pin pitch is 0.40mm. The through-hole package design simplifies PCB layout and maintains signal integrity on high-speed lines. The combination of low ESD peak clamping, low dynamic resistance, and innovative package design enables this device to deliver the highest level of ESD protection for applications such as USB 3.0, HDMI, and V-By-One interfaces.

Caratteristiche

Traduzione AI
  • Compliant with IEC 61000-4-2 (ESD) for ESD protection on high-speed data lines: air discharge ±30kV, contact discharge ±25kV; compliant with IEC 61000-4-5 (Surge): 5A (8/20μs); compliant with IEC 61000-4-4 (EFT): 40A (5/50ns)
  • Through-hole design
  • Protects four high-speed lines
  • Low capacitance: 0.40pF typical (I/O to GND)
  • Low ESD clamping voltage
  • Ultra-low dynamic resistance: 0.35Ω (typical)
  • Solid-state silicon avalanche technology

Applicazioni

Traduzione AI
  • USB 3.0
  • HDMI 1.3/1.4
  • 10GBase-T Ethernet
  • V-By-One
  • DisplayPort
  • MHL
  • LVDS Interface
  • eSATA Interface