Zdjęcia poglądowe
Modele EDAEasyEDA
Infineon S25HS512TFABHV013
| Producent | |
| Nr części prod. | S25HS512TFABHV013 |
| Nr LCSC | C6670702 |
| Opak. | BGA-24(6x8) |
| Numer Klienta | |
| Klucz. cechy | 512Mbit 1.7V~2V 166MHz SPI BGA-24(6x8) Memory RoHS |
| Karta Katalogowa | Infineon S25HS512TFABHV013 |
| Części alternatywne | 5 |
Specyfikacje Produktu
Wszystko
| Typ | Opis | |
|---|---|---|
| Kategoria | Integrated Circuits (ICs)/Memory/Memory | |
| Producent | Infineon | |
| Opak. | BGA-24(6x8) | |
| Operating Temperature | - | |
| Features | Power-on reset;Hardware write protection;ECC error correction | |
| Memory Size | 512Mbit | |
| Voltage - Supply | 1.7V~2V | |
| Program / Erase Cycles | 1,280,000 Cycles | |
| Clock Frequency | 166MHz | |
| Data Retention - TDR (Year) | 25 Years | |
| Block Erase Time(tBE) | - | |
| Write Cycle Time(tWC) | - | |
| Page Programming Time (Tpp) | - | |
| Standby Supply Current | 0.011mA | |
| Interface | SPI |
| Typ | Opis | |
|---|---|---|
| Kategoria | Integrated Circuits (ICs)/Memory/Memory | |
| Producent | Infineon | |
| Opak. | BGA-24(6x8) | |
| Operating Temperature | - | |
| Features | Power-on reset;Hardware write protection;ECC error correction | |
| Memory Size | 512Mbit | |
| Voltage - Supply | 1.7V~2V | |
| Program / Erase Cycles | 1,280,000 Cycles |
| Typ | Opis | |
|---|---|---|
| Clock Frequency | 166MHz | |
| Data Retention - TDR (Year) | 25 Years | |
| Block Erase Time(tBE) | - | |
| Write Cycle Time(tWC) | - | |
| Page Programming Time (Tpp) | - | |
| Standby Supply Current | 0.011mA | |
| Interface | SPI |
Pomoc i opiniePokaż podobne produkty (0) >
Funkcje
Tłumaczenie AI
- 45nm technology, 2 bits stored per memory array cell
- Multiple sector architecture options: uniform (all sectors 256KB), hybrid 1 (top or bottom 32×4KB sectors, remainder 256KB), hybrid 2 (top and bottom 16×4KB sectors each, remainder 256KB)
- Page program buffer: 256 or 512 bytes
- 1024-byte (32×32 bytes) one-time programmable Security Silicon region
- Quad SPI interface supporting multiple protocols (1S-1S-4S, 1S-4S-4S, etc.); SDR up to 83 Mbps (166 MHz clock), DDR up to 102 Mbps (102 MHz clock)
- Dual SPI interface supporting 1S-2S-2S protocol; SDR up to 41.5 Mbps (166 MHz clock)
- Standard SPI interface supporting 1S-1S-1S protocol; SDR up to 21 Mbps (166 MHz clock)
- Functional safety features compliant with ISO 26262 ASIL B, ASIL D ready
- Endurance Flex architecture with high-endurance and extended data retention partitions
- Data integrity CRC for memory array error detection
- Secure boot: reports device initialization failures, detects configuration corruption, and provides recovery options
- ECC with single-bit error correction and double-bit error detection
- Sector erase status indicator for power interruption during erase
- Protection features including legacy memory array and configuration protection, and advanced sector protection at individual sector granularity
- Auto-boot for immediate memory array access after power-up
- Hardware reset via CS#, dedicated RESET# pin, or DQ3_RESET# pin
- SFDP support for device capability and feature discovery
- Device ID, manufacturer ID, and identification
- Data integrity: 256Mb main array minimum 640K program/erase cycles; 512Mb: 1.28M cycles; 1Gb: 2.56M cycles; 4KB sectors on all devices minimum 300K program/erase cycles; minimum 25-year data retention
- Operating voltage: 1.7V to 2.0V (HS-T) or 2.7V to 3.6V (HL-T)
- Operating temperature: Industrial -40°C to +85°C; Extended Industrial -40°C to +105°C; Automotive AEC-Q100 Grade 3: -40°C to +85°C; Grade 2: -40°C to +105°C; Grade 1: -40°C to +125°C
- Package options: 256Mb and 512Mb — 16-pin SOIC (300mil) SO3016, 24-ball BGA (6×8 mm), 16-pin SOIC (300mil), 8-contact WSON (6×8 mm); 1Gb — 16-pin SOIC (300mil) SO3016, 24-ball BGA (8×8 mm), 16-pin SOIC (300mil)
Gwarancja na każde zamówienie
100% Oryginalne · Zwrot lub Wymiana w ciągu 30 Dni
Brak w magazynie
Powiadom mnie
Minimum: 1Wielokrotność: 1Jednostka sprzedaży: Piece
Dodaj do Listy BOM
| Szt. | Cena jedn.(Tylko do wglądu) | Suma całkowita |
|---|---|---|
| 1+ | $ 20.9995 | $ 21.00 |
| 200+ | $ 8.3792 | $ 1675.84 |
| 500+ | $ 8.0998 | $ 4049.90 |
| 1,000+ | $ 7.9617 | $ 7961.70 |
Standardowa Obudowa2500/Full Reel | ||
Lepsza cena za większą ilość?
$
Specyfikacje Produktu
Wszystko
| Typ | Opis | |
|---|---|---|
| Kategoria | Integrated Circuits (ICs)/Memory/Memory | |
| Producent | Infineon | |
| Opak. | BGA-24(6x8) | |
| Operating Temperature | - | |
| Features | Power-on reset;Hardware write protection;ECC error correction | |
| Memory Size | 512Mbit | |
| Voltage - Supply | 1.7V~2V | |
| Program / Erase Cycles | 1,280,000 Cycles | |
| Clock Frequency | 166MHz | |
| Data Retention - TDR (Year) | 25 Years | |
| Block Erase Time(tBE) | - | |
| Write Cycle Time(tWC) | - | |
| Page Programming Time (Tpp) | - | |
| Standby Supply Current | 0.011mA | |
| Interface | SPI |
| Typ | Opis | |
|---|---|---|
| Kategoria | Integrated Circuits (ICs)/Memory/Memory | |
| Producent | Infineon | |
| Opak. | BGA-24(6x8) | |
| Operating Temperature | - | |
| Features | Power-on reset;Hardware write protection;ECC error correction | |
| Memory Size | 512Mbit | |
| Voltage - Supply | 1.7V~2V | |
| Program / Erase Cycles | 1,280,000 Cycles |
| Typ | Opis | |
|---|---|---|
| Clock Frequency | 166MHz | |
| Data Retention - TDR (Year) | 25 Years | |
| Block Erase Time(tBE) | - | |
| Write Cycle Time(tWC) | - | |
| Page Programming Time (Tpp) | - | |
| Standby Supply Current | 0.011mA | |
| Interface | SPI |
Pomoc i opiniePokaż podobne produkty (0) >
Funkcje
Tłumaczenie AI
- 45nm technology, 2 bits stored per memory array cell
- Multiple sector architecture options: uniform (all sectors 256KB), hybrid 1 (top or bottom 32×4KB sectors, remainder 256KB), hybrid 2 (top and bottom 16×4KB sectors each, remainder 256KB)
- Page program buffer: 256 or 512 bytes
- 1024-byte (32×32 bytes) one-time programmable Security Silicon region
- Quad SPI interface supporting multiple protocols (1S-1S-4S, 1S-4S-4S, etc.); SDR up to 83 Mbps (166 MHz clock), DDR up to 102 Mbps (102 MHz clock)
- Dual SPI interface supporting 1S-2S-2S protocol; SDR up to 41.5 Mbps (166 MHz clock)
- Standard SPI interface supporting 1S-1S-1S protocol; SDR up to 21 Mbps (166 MHz clock)
- Functional safety features compliant with ISO 26262 ASIL B, ASIL D ready
- Endurance Flex architecture with high-endurance and extended data retention partitions
- Data integrity CRC for memory array error detection
- Secure boot: reports device initialization failures, detects configuration corruption, and provides recovery options
- ECC with single-bit error correction and double-bit error detection
- Sector erase status indicator for power interruption during erase
- Protection features including legacy memory array and configuration protection, and advanced sector protection at individual sector granularity
- Auto-boot for immediate memory array access after power-up
- Hardware reset via CS#, dedicated RESET# pin, or DQ3_RESET# pin
- SFDP support for device capability and feature discovery
- Device ID, manufacturer ID, and identification
- Data integrity: 256Mb main array minimum 640K program/erase cycles; 512Mb: 1.28M cycles; 1Gb: 2.56M cycles; 4KB sectors on all devices minimum 300K program/erase cycles; minimum 25-year data retention
- Operating voltage: 1.7V to 2.0V (HS-T) or 2.7V to 3.6V (HL-T)
- Operating temperature: Industrial -40°C to +85°C; Extended Industrial -40°C to +105°C; Automotive AEC-Q100 Grade 3: -40°C to +85°C; Grade 2: -40°C to +105°C; Grade 1: -40°C to +125°C
- Package options: 256Mb and 512Mb — 16-pin SOIC (300mil) SO3016, 24-ball BGA (6×8 mm), 16-pin SOIC (300mil), 8-contact WSON (6×8 mm); 1Gb — 16-pin SOIC (300mil) SO3016, 24-ball BGA (8×8 mm), 16-pin SOIC (300mil)
C6670702 Biblioteka EasyEDA
Zgodność & Kody Eksportowe
| Typ | Szczegóły |
|---|---|
| RoHS | ROHS Compliant |
| ECCN | 3A991B1A |
| CNHTS | 8542329000 |
| USHTS | 8542320071 |
| TARIC | 8542329000 |
| CAHTS | 8542330000 |
| BRHTS | 85423299 |
| INHTS | 85423200 |
| MXHTS | 8542.32.99 |
| Typ | Szczegóły |
|---|---|
| RoHS | ROHS Compliant |
| ECCN | 3A991B1A |
| CNHTS | 8542329000 |
| USHTS | 8542320071 |
| TARIC | 8542329000 |
| Typ | Szczegóły |
|---|---|
| CAHTS | 8542330000 |
| BRHTS | 85423299 |
| INHTS | 85423200 |
| MXHTS | 8542.32.99 |
Części alternatywne
| MPN | Producent | Typ alternatywny | Opakowanie | Dostępność | Cena jednostkowa | ||
|---|---|---|---|---|---|---|---|
| MT35XU512ABA1G12-0AAT | micron | Podobne | TPBGA-24(6x8) | 2 | $ 27.1483 | ||
| MT35XU512ABA1G12-0AUT | micron | Podobne | TPBGA-24(6x8) | 1 | $ 22.1507 | ||
| IS25WP512M-RHLE | ISSI | Podobne | TFBGA-24(6x8) | 1 | $ 19.685 | ||
| IS25WP512M-RHLA3 | ISSI | Podobne | TFBGA-24(6x8) | 20 | $ 16.8399 | ||
| S25HS512TFABHB010 | Infineon | Podobne | BGA-24(6x8) | 0 | $ 19.836 |