AEM MLV0402ES024V02R5P

Surface Mount Multilayer Varistor ESD Protection (ES) Series

Fast response <0.5 ns

• Low operating voltage 5 V
• Low capacitance
• Low leakage current <1 μA
• Low clamping voltage

Applications:

• Mobile phones
• Digital cameras
• PDA
• MP3 players / Notebooks

Operating Temperature:

• For 0603 or smaller: -55℃ to +85℃
• For 0805 or larger: -55℃ to +125℃

Terms and Definitions:

• Maximum Operating Voltage: Maximum steady-state DC operating voltage at which typical leakage current is less than 50 μA at 25℃
• Breakdown Voltage (BDV): Breakdown DC voltage measured at 1 mA
• Maximum Clamping Voltage: Maximum peak voltage across the component measured at specified pulse current and waveform
• Surge Current: Maximum peak current at specified 8/20 μs waveform without damage
• Energy Absorption: Maximum energy dissipation at specified 10/1000 μs waveform without damage
• Typical Capacitance: Capacitance measured at 1 KHz or 1 MHz with bias voltage less than 0.5 Vrms
• Nonlinearity Coefficient α: α = (log (V1mA/V0.1mA) / log (Iv1mA/lv0.1mA))
• Leakage Current: Typical leakage current < 50 μA at 25℃; maximum leakage current 200 μA
• Cutoff Frequency: Frequency at -3 dB insertion loss

Environmental Tests:

1. Soldering Heat: BDV change ≤ ±10% (immersion at 260℃ for 5 seconds, MIL-STD-202 Method 210)
2. Resistance to Soldering: No mechanical damage, new solder coverage ≥ 80% (immersion at 255℃ for 5 seconds, non-active flux, IEC60068-2-20, MIL-STD-202 Method 208)
3. Maximum Surge Current: BDV change ≤ ±10%, no mechanical damage (100 pulses at 8/20 μs, maximum surge current, 30-second intervals, at 25℃ and 30~65% RH, IEC60068-2-20, CECC42000, IEC 1051-1 Test 4.5)
4. Maximum Surge Energy: BDV change ≤ ±10%, no mechanical damage (100 pulses at 10/1000 μs, maximum surge current, 90-second intervals, at 25℃ and 30~65% RH, CECC42000)
5. Temperature Cycling: BDV change ≤ ±10%, no mechanical damage (5 cycles between -40℃ and 125℃, dwell 30 minutes at extreme temperatures, dwell 60 minutes at 25℃, CECC 42000, IEC60068-2-14)
6. Cold Resistance: Leakage current ≤ 200 μA, BDV change ≤ ±10%, no mechanical damage (1000 hours at -50℃, IEC 60068-2-1)
7. Cold Load Resistance: Leakage current ≤ 200 μA, BDV change ≤ ±10%, no mechanical damage (1000 hours at -50℃ with operating voltage applied, IEC 60068-2-1)
8. High Temperature Resistance: Leakage current ≤ 200 μA, BDV change ≤ ±10%, no mechanical damage (1000 hours at 150℃, MIL-STD-202 Method 108)
9. High Temperature Load Resistance: Leakage current ≤ 200 μA, BDV change ≤ ±10%, no mechanical damage (1000 hours at 85℃ with operating voltage applied, CECC 42000, CECC42000)
10. Humidity Resistance: Leakage current ≤ 200 μA, BDV change ≤ ±10%, no mechanical damage (500 hours at 40℃ and 90~95% RH, MIL-STD-202 Method 103, IEC 60068-2-3)
11. Humidity Load Resistance: Leakage current ≤ 200 μA, BDV change ≤ ±10%, no mechanical damage (500 hours at 40℃ and 90~95% RH with operating voltage applied, CECC42000, MIL-STD-202 Method 103, IEC 60068-2-3)
12. ESD Contact Test: Leakage current ≤ 200 μA, varistor voltage change > 115% of operating voltage (100 contact ESD discharges, 1-second intervals, 8 KV (Level 4), polarity: +/-, CECC42000, IEC61000-4-2)
13. ESD Air Test: Varistor voltage change > 115% of operating voltage (100 air-discharge ESD discharges, 1-second intervals, 15 KV (Level 4), polarity: +/-, IEC 61000-4-2)

Soldering Temperature Profile:

• Preheat/Soak: Minimum temperature (Tsmin) 150℃, maximum temperature (Tsmax) 200℃, time (ts) from Tsmin to Tsmax 60~120 seconds
• Ramp-up rate (TL to Tp): Max 3℃/s
• Liquidus temperature (TL): 217℃
• Time above TL (t): 60~150 seconds
• Peak package temperature (Tp): 260℃
• Time (tp) within 5℃ of specified classification temperature (Tc): 30 seconds
• Ramp-down rate (Tp to TL): Max 6℃/s
• Time from 25℃ to peak temperature: Max 8 minutes

• Fast Response <0.5 ns
• Low Working Voltage 5 V
• Low Capacitance
• Low Leakage Current <1 μA
• Low Clamping Voltage

• Cell Phones
• Digital Cameras
• PDAs
• MP3 Notebooks